SiC MOS电容器的超浅缺陷

Razvan Pascu
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引用次数: 2

摘要

在低温(14 - 500 K)下进行的电容电压测量已被用于确定SiC MOS电容器的超浅界面状态。这些态占据了SiC带隙中不同能级的能级,最高可达传导带以下27 meV。此外,随着温度的升高,电容电压特性向更低的电压移动,表明平带电压从14.65 (14 K)降低到2.77 V (500 K)。结果表明,在420 K时,外延层的氮供体发生完全电离。从这些分析中,确定了活化能约为26.79 meV。为了确定SiC带隙中界面态的能级分布,计算了费米能级随温度的变化,在SiC导带下,从14 K时的27.1 meV左右开始,到500 K时达到321 meV。在SiC带隙中不同能级的界面态密度分布中发现了6个峰(D1 - D6),这可能对应了SiO2/SiC界面上不同的缺陷。
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Ultrashallow defects in SiC MOS capacitors

Capacitance-voltage measurements performed at cryogenic temperatures (14 – 500 K) have been used to determine the ultrashallow interface states in SiC MOS capacitors. These states occupies energy levels in SiC band gap on different energy levels up to 27 meV below the conduction band. Moreover, the capacitance-voltage characteristics are moving to lower voltages with temperature increasing, indicating a reduction in flat band voltage from 14.65 (14 K) to 2.77 V (500 K). It was demonstrated that a complete ionization of the nitrogen donors from the epitaxial layer occurs at 420 K. From these analysis, an activation energy of around 26.79 meV was determined. In order to determine the energy levels distribution of the interface states in SiC band gap, the Fermi level variation with temperature was calculated, starting from a value of around 27.1 meV at 14 K and reaching a value of 321 meV at 500 K under SiC conduction band. Six peaks (D1 – D6) have been identified in interface states density distribution at different levels of energy in SiC band gap, which could correspond to different defects at the SiO2/SiC interface.

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