2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) - 最新文献

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Functional Demonstration of < 0.4-pJ/bit, 9.8 μm Fine-Pitch Dielet-to-Dielet Links for Advanced Packaging using Silicon Interconnect Fabric

Pub Date : 2022-05-01 DOI: 10.1109/ectc51906.2022.00332 Krutikesh Sahoo, Uneeb Rathore, Siva Chandra Jangam, Tri Nguyen, D. Markovic, S. Iyer

The Effect of Thermal Stress on the Reliability of all-Printed Vias on Flexible Substrates

Pub Date : 2022-05-01 DOI: 10.1109/ectc51906.2022.00259 Udara S. Somarathna, M. Alhendi, B. Garakani, M. Poliks, D. Weerawarne, J. Iannotti, C. Kapusta, N. Stoffel, S. G. Gonya

Evaluation of the Transmission Loss of Soluble Polyphenylene Ether Composite Material in a Millimeter-Wave Region

Pub Date : 2022-05-01 DOI: 10.1109/ectc51906.2022.00016 Shoya Sekiguchi, K. Oki, Shoko Mishima, Yuya Fukata, Kaho Shibasaki, N. Ishikawa, T. Ogata

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