Evaluation of the Transmission Loss of Soluble Polyphenylene Ether Composite Material in a Millimeter-Wave Region

Shoya Sekiguchi, K. Oki, Shoko Mishima, Yuya Fukata, Kaho Shibasaki, N. Ishikawa, T. Ogata
{"title":"Evaluation of the Transmission Loss of Soluble Polyphenylene Ether Composite Material in a Millimeter-Wave Region","authors":"Shoya Sekiguchi, K. Oki, Shoko Mishima, Yuya Fukata, Kaho Shibasaki, N. Ishikawa, T. Ogata","doi":"10.1109/ectc51906.2022.00016","DOIUrl":null,"url":null,"abstract":"Fifth generation (5G) and beyond wireless networks require high-frequency signals for high-speed, high-capacity, and low-latency communication. These high-frequency signals undergo extensive transmission losses. Furthermore, the terahertz band is being considered for 6th-generation (6G) networks. Therefore, transmission loss must be considered in the design of antenna components and high-frequency circuit boards. To reduce the transmission loss, we developed a material with alow dielectric constant (Dk) and low dissipation factor (Df). We used polyphenylene ether (PPE) owing to its low Dk and Df. We modified the structure of PPE to obtain soluble PPE that dissolves in common organic solvents. The composite material was prepared using the as-prepared soluble PPE. The as-prepared soluble-PPE-based composite material (SPCM) exhibited excellent Dk and Df of 3.1 and 0.0013, respectively, at 10 GHz. We fabricated a microstrip line on the SPCM and measured its transmission losses. At 95 GHz, the transmission loss was 14.2 dB/100 mm. This result can be attributed to the excellent dielectric properties and small surface roughness offered by the excellent hydrophobicity of the SPCM.","PeriodicalId":139520,"journal":{"name":"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2022-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ectc51906.2022.00016","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

Fifth generation (5G) and beyond wireless networks require high-frequency signals for high-speed, high-capacity, and low-latency communication. These high-frequency signals undergo extensive transmission losses. Furthermore, the terahertz band is being considered for 6th-generation (6G) networks. Therefore, transmission loss must be considered in the design of antenna components and high-frequency circuit boards. To reduce the transmission loss, we developed a material with alow dielectric constant (Dk) and low dissipation factor (Df). We used polyphenylene ether (PPE) owing to its low Dk and Df. We modified the structure of PPE to obtain soluble PPE that dissolves in common organic solvents. The composite material was prepared using the as-prepared soluble PPE. The as-prepared soluble-PPE-based composite material (SPCM) exhibited excellent Dk and Df of 3.1 and 0.0013, respectively, at 10 GHz. We fabricated a microstrip line on the SPCM and measured its transmission losses. At 95 GHz, the transmission loss was 14.2 dB/100 mm. This result can be attributed to the excellent dielectric properties and small surface roughness offered by the excellent hydrophobicity of the SPCM.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
可溶聚苯醚复合材料在毫米波区传输损耗的评价
第五代(5G)及以后的无线网络需要高频信号来实现高速、高容量和低延迟的通信。这些高频信号经历了广泛的传输损耗。此外,太赫兹频段正在考虑用于第6代(6G)网络。因此,在天线元件和高频电路板的设计中必须考虑传输损耗。为了降低传输损耗,我们开发了一种低介电常数(Dk)和低耗散因子(Df)的材料。我们使用了聚苯醚(PPE),因为它的Dk和Df都很低。我们对PPE的结构进行了修饰,得到了可溶于普通有机溶剂的PPE。采用制备好的可溶性PPE制备复合材料。制备的可溶聚苯乙烯基复合材料(SPCM)在10 GHz下的Dk和Df分别为3.1和0.0013。我们在SPCM上制作了微带线,并测量了其传输损耗。在95 GHz时,传输损耗为14.2 dB/100 mm。这一结果可归因于SPCM优异的介电性能和表面粗糙度小。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Transient Thermal Modeling of Die Bond Process in Multiple Die Stacked Flash Memory Package Development and Application of the Moisture-Dependent Viscoelastic Model of Polyimide in Hygro-Thermo-Mechanical Analysis of Fan-Out Interconnect Superb sinterability of the Cu paste consisting of bimodal size distribution Cu nanoparticles for low-temperature and pressureless sintering of large-area die attachment and the sintering mechanism Demonstration of Substrate Embedded Ni-Zn Ferrite Core Solenoid Inductors Using a Photosensitive Glass Substrate A De-Embedding and Embedding Procedure for High-Speed Channel Eye Diagram Oscilloscope Measurement
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1