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EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

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EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

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EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - 最新文献

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Induced delamination of silicon-molding compound interfaces

Pub Date : 2009-04-26 DOI: 10.1109/ESIME.2009.4938478 G. Schlottig, H. Pape, B. Wunderle, L. Ernst

Experimental and numerical analyses of flexible PCBs under various loading conditions

Pub Date : 2009-04-26 DOI: 10.1109/ESIME.2009.4938493 L. Arruda, R. Bonadiman, Costa Josineto, G. Freitas

Modelling of process and reliability of press-fit interconnections

Pub Date : 2009-04-26 DOI: 10.1109/ESIME.2009.4938502 T. Fellner, E. Zukowski, J. Wilde
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