EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems最新文献
Pub Date : 2009-04-26DOI: 10.1109/ESIME.2009.4938478
G. Schlottig, H. Pape, B. Wunderle, L. Ernst
Interface fracture properties are increasingly requested in electronic packaging, be it for design problems or reliability issues. We demonstrate an induced delamination of the epoxy molding compound and die silicon interface, and propose a mixed mode chisel testing setup (MMC) and its experimental procedure. The MMC addresses several drawbacks of existing methods. The work includes samples from package fabrication processes and the establishing of critical fracture mechanics properties through finite element simulation. The setup allows for the investigation of interfaces at package scale.
{"title":"Induced delamination of silicon-molding compound interfaces","authors":"G. Schlottig, H. Pape, B. Wunderle, L. Ernst","doi":"10.1109/ESIME.2009.4938478","DOIUrl":"https://doi.org/10.1109/ESIME.2009.4938478","url":null,"abstract":"Interface fracture properties are increasingly requested in electronic packaging, be it for design problems or reliability issues. We demonstrate an induced delamination of the epoxy molding compound and die silicon interface, and propose a mixed mode chisel testing setup (MMC) and its experimental procedure. The MMC addresses several drawbacks of existing methods. The work includes samples from package fabrication processes and the establishing of critical fracture mechanics properties through finite element simulation. The setup allows for the investigation of interfaces at package scale.","PeriodicalId":225582,"journal":{"name":"EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"72 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121028430","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-04-26DOI: 10.1109/ESIME.2009.4938493
L. Arruda, R. Bonadiman, Costa Josineto, G. Freitas
This work will present case studiesof three types of Flexible Printable Circuits subjected to different loading conditions in order to evaluate their tecnologies regarding mechanical reliability. Typical causes of failure in electronic devices are associated with mechanical stress, moisture, heat from transportation and field use. Typically manufacturers carry out tests to evaluate the reliability of electronic components regarding these environmental loads. Common tools used for this evaluation, in early stages of design, are FEA (Finite Element Analysis) and experimental laboratory tests. In this work simulation models were generated aiming at developing tools for early stages of design, and mechanical tests were performed to assess actual reliability of parts and also to provide information to evaluate the simulation models. The different types of failure in the flexible printed embeded circuits, such as delamination, will be presented. Failures due to high shear stresses in flex- rigid joints will also be evaluated. Experimental tests and computational simulation will also be applied in order to perform these evaluations.
{"title":"Experimental and numerical analyses of flexible PCBs under various loading conditions","authors":"L. Arruda, R. Bonadiman, Costa Josineto, G. Freitas","doi":"10.1109/ESIME.2009.4938493","DOIUrl":"https://doi.org/10.1109/ESIME.2009.4938493","url":null,"abstract":"This work will present case studiesof three types of Flexible Printable Circuits subjected to different loading conditions in order to evaluate their tecnologies regarding mechanical reliability. Typical causes of failure in electronic devices are associated with mechanical stress, moisture, heat from transportation and field use. Typically manufacturers carry out tests to evaluate the reliability of electronic components regarding these environmental loads. Common tools used for this evaluation, in early stages of design, are FEA (Finite Element Analysis) and experimental laboratory tests. In this work simulation models were generated aiming at developing tools for early stages of design, and mechanical tests were performed to assess actual reliability of parts and also to provide information to evaluate the simulation models. The different types of failure in the flexible printed embeded circuits, such as delamination, will be presented. Failures due to high shear stresses in flex- rigid joints will also be evaluated. Experimental tests and computational simulation will also be applied in order to perform these evaluations.","PeriodicalId":225582,"journal":{"name":"EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128213627","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-04-26DOI: 10.1109/ESIME.2009.4938502
T. Fellner, E. Zukowski, J. Wilde
This investigation is aimed at the stability of press-fit interconnections for MID. Moulded Interconnect Devices (MID) are 3-dimensional substrates produced by thermoplastic injection moulding for large-series applications. The assembly process of press-fit interconnections has been correctly modelled with a FE-Software. With this model the behaviour of the mechanical contact pressure, which decreases due to creep in the thermoplastic base material, could be described. Especially, the modelling is a tool to optimize pin and hole geometries. In order to obtain realistic results, the creep law parameters for the applied base material, a liquid-crystal polymer (LCP), was fitted to experimental. The required coefficients of friction were determined by adapting the simulations to the experiments. The time-dependent retention force between a pin and the substrate directly after assembly or after temperature loads could be predicted with finite element analyses, which was used as reliability criterion.
{"title":"Modelling of process and reliability of press-fit interconnections","authors":"T. Fellner, E. Zukowski, J. Wilde","doi":"10.1109/ESIME.2009.4938502","DOIUrl":"https://doi.org/10.1109/ESIME.2009.4938502","url":null,"abstract":"This investigation is aimed at the stability of press-fit interconnections for MID. Moulded Interconnect Devices (MID) are 3-dimensional substrates produced by thermoplastic injection moulding for large-series applications. The assembly process of press-fit interconnections has been correctly modelled with a FE-Software. With this model the behaviour of the mechanical contact pressure, which decreases due to creep in the thermoplastic base material, could be described. Especially, the modelling is a tool to optimize pin and hole geometries. In order to obtain realistic results, the creep law parameters for the applied base material, a liquid-crystal polymer (LCP), was fitted to experimental. The required coefficients of friction were determined by adapting the simulations to the experiments. The time-dependent retention force between a pin and the substrate directly after assembly or after temperature loads could be predicted with finite element analyses, which was used as reliability criterion.","PeriodicalId":225582,"journal":{"name":"EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"27 4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128295893","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-04-26DOI: 10.1109/ESIME.2009.4938460
T. Falat, K. Jansen, J. de Vreugd, S. Rzepka
Commercial FEM software codes do not directly support the cure dependency of polymers behavior. In electronics packaging, for example, cure shrinkage of the molding compound is consequently treated as a surplus to thermal contraction and its changes in visco-elastic behavior during curing are usually ignored. This give rise to inaccurate results and may cause difficulties even in recognizing factors important for further optimization. This work introduces a cure dependent visco-elastic material model being implemented into ANSYS by USERMAT, the user material subroutine. The results obtained when simulating the warpage of bi-material strips during and after curing with the full scale material model were compared to those obtained with simplified material models. Varying the geometric configuration different changes in the deformation results have been found caused by cure dependency anywhere between −10%, 0%, and +20%. Hence, correct results can only be achieved in general case with models accounting for cure dependency directly.
{"title":"Influence of cure dependency of molding compound properties on warpage and stress distribution during and after the encapsulation of electronics components","authors":"T. Falat, K. Jansen, J. de Vreugd, S. Rzepka","doi":"10.1109/ESIME.2009.4938460","DOIUrl":"https://doi.org/10.1109/ESIME.2009.4938460","url":null,"abstract":"Commercial FEM software codes do not directly support the cure dependency of polymers behavior. In electronics packaging, for example, cure shrinkage of the molding compound is consequently treated as a surplus to thermal contraction and its changes in visco-elastic behavior during curing are usually ignored. This give rise to inaccurate results and may cause difficulties even in recognizing factors important for further optimization. This work introduces a cure dependent visco-elastic material model being implemented into ANSYS by USERMAT, the user material subroutine. The results obtained when simulating the warpage of bi-material strips during and after curing with the full scale material model were compared to those obtained with simplified material models. Varying the geometric configuration different changes in the deformation results have been found caused by cure dependency anywhere between −10%, 0%, and +20%. Hence, correct results can only be achieved in general case with models accounting for cure dependency directly.","PeriodicalId":225582,"journal":{"name":"EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124121011","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-04-26DOI: 10.1109/ESIME.2009.4938425
Q. Chen, Leon Xu, Cherie Jing, Tom Xue, Bin Wang, Tiejun Zhao, A. Salo, K. Ojala
In this paper, a wrist device conception was selected to study the reliability of flexible devices by drop test simulation. In the conception device, all of the components cannot be made flexible immediately. Some of them are still rigid, such as the Ball Grid Array (BGA), the connector, and some other big components like the vibrator. The reliability of the device, where such rigid components are mounted on a flexible plastic substrate, is anything but guaranteed. In this study, a system level simulation model of a drop test was developed. In this simulation model, there are some challenges, such as the uncertain initial shape of the assembled products, the long impact time, and the unknown mechanical behaviours of new materials. To solve these problems, some manual work and some model simplification were performed. For the flexible device, the reliability study focussed on the electrical connection and the assembly processes. Before building the model, structural analysis of this device had been carried out first. Based on this analysis, some points of potential concern were identified. Based on these points, several submodels were refined such as the display, the BGA solder joint, and the Flexible Printed Circuit (FPC) copper trace. Seven drop simulations had been executed with different drop directions. There were six basic orthogonal drop directions and one additional drop direction, that was anticipated to have a serious impact on the reliability of the device. Through the simulations, some weak locations were pointed out by the observation of the stress level of Von Mises in the drop test. The results were delivered to the electronical and mechanical designer for reference in the new design and some actions were taken to optimize the design.
{"title":"Drop test simulation study of flexible devices","authors":"Q. Chen, Leon Xu, Cherie Jing, Tom Xue, Bin Wang, Tiejun Zhao, A. Salo, K. Ojala","doi":"10.1109/ESIME.2009.4938425","DOIUrl":"https://doi.org/10.1109/ESIME.2009.4938425","url":null,"abstract":"In this paper, a wrist device conception was selected to study the reliability of flexible devices by drop test simulation. In the conception device, all of the components cannot be made flexible immediately. Some of them are still rigid, such as the Ball Grid Array (BGA), the connector, and some other big components like the vibrator. The reliability of the device, where such rigid components are mounted on a flexible plastic substrate, is anything but guaranteed. In this study, a system level simulation model of a drop test was developed. In this simulation model, there are some challenges, such as the uncertain initial shape of the assembled products, the long impact time, and the unknown mechanical behaviours of new materials. To solve these problems, some manual work and some model simplification were performed. For the flexible device, the reliability study focussed on the electrical connection and the assembly processes. Before building the model, structural analysis of this device had been carried out first. Based on this analysis, some points of potential concern were identified. Based on these points, several submodels were refined such as the display, the BGA solder joint, and the Flexible Printed Circuit (FPC) copper trace. Seven drop simulations had been executed with different drop directions. There were six basic orthogonal drop directions and one additional drop direction, that was anticipated to have a serious impact on the reliability of the device. Through the simulations, some weak locations were pointed out by the observation of the stress level of Von Mises in the drop test. The results were delivered to the electronical and mechanical designer for reference in the new design and some actions were taken to optimize the design.","PeriodicalId":225582,"journal":{"name":"EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131954312","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-04-26DOI: 10.1109/ESIME.2009.4938512
F. Gao, J. Jing, F. Liang, R. L. Williams, J. Qu
The interfacial failure behavior of a single solder joint is investigated under the pure tensile or shear loading at 5 mm/s. The brittel failure is detected for the specimen under pure tension loading, while a ductile failure is found after pure shear loading. A cohesive zone model is employed herein to explore the dynamic fracture behavior at the solder/IMC and IMC/Cu pad interfaces. The simulated results show that these two interfaces possess different mechanical properties. Under pure tensile loading at 5 mm/s, the damage typically starts at the edge of the solder/IMC interface, while the crack is eventually generated and propagated at the IMC/Cu pad interface, which corresponds to a typical brittle interfacial failure.
{"title":"Cohesive zone simulation on dynamic fracture at the interfaces of a single solder joint","authors":"F. Gao, J. Jing, F. Liang, R. L. Williams, J. Qu","doi":"10.1109/ESIME.2009.4938512","DOIUrl":"https://doi.org/10.1109/ESIME.2009.4938512","url":null,"abstract":"The interfacial failure behavior of a single solder joint is investigated under the pure tensile or shear loading at 5 mm/s. The brittel failure is detected for the specimen under pure tension loading, while a ductile failure is found after pure shear loading. A cohesive zone model is employed herein to explore the dynamic fracture behavior at the solder/IMC and IMC/Cu pad interfaces. The simulated results show that these two interfaces possess different mechanical properties. Under pure tensile loading at 5 mm/s, the damage typically starts at the edge of the solder/IMC interface, while the crack is eventually generated and propagated at the IMC/Cu pad interface, which corresponds to a typical brittle interfacial failure.","PeriodicalId":225582,"journal":{"name":"EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"202 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131984623","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-04-26DOI: 10.1109/ESIME.2009.4938414
F. Song, T. Jiang, J. Lo, S. Lee, K. Newman
Due to environmental consciousness and legislative regulations, Pb-free solders have been increasingly used for replacement of conventional SnPb solders in the microelectronic industry. However, during the transition period from SnPb to Pb-free solders, some products will potentially consist of mixtures of Pb-free with SnPb solders. This paper presents the results of microstructural analysis of mixed solder joints which are formed by attaching different alloys of solder balls and pastes on the OSP pad finish. The effect of thermal aging on the strength and fracture energy of the mixed solder balls during high speed ball shear/pull tests was also investigated in the study. The test specimens were aged at 125°C for durations of 200, 500 and 1000 hours. The correlations between the solder ball fracture force/energy, failure modes and intermetallic compound (IMC) thickness of the mixed alloy solder joints are also established.
{"title":"Investigation of mixed SAC and SnPb solder balls under high speed ball shear and pull tests","authors":"F. Song, T. Jiang, J. Lo, S. Lee, K. Newman","doi":"10.1109/ESIME.2009.4938414","DOIUrl":"https://doi.org/10.1109/ESIME.2009.4938414","url":null,"abstract":"Due to environmental consciousness and legislative regulations, Pb-free solders have been increasingly used for replacement of conventional SnPb solders in the microelectronic industry. However, during the transition period from SnPb to Pb-free solders, some products will potentially consist of mixtures of Pb-free with SnPb solders. This paper presents the results of microstructural analysis of mixed solder joints which are formed by attaching different alloys of solder balls and pastes on the OSP pad finish. The effect of thermal aging on the strength and fracture energy of the mixed solder balls during high speed ball shear/pull tests was also investigated in the study. The test specimens were aged at 125°C for durations of 200, 500 and 1000 hours. The correlations between the solder ball fracture force/energy, failure modes and intermetallic compound (IMC) thickness of the mixed alloy solder joints are also established.","PeriodicalId":225582,"journal":{"name":"EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130231377","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-04-26DOI: 10.1109/ESIME.2009.4938448
F. Naumann, M. Ebert, J. Hildenbrand, E. Moretton, C. Peter, J. Wollenstein
The numerical pre-design of a novel micro-machined thermal infrared emitter, using a spider type hotplate concept is presented. The spider concept introduced allows the fast transient operation of the emitter and thus a direct modulation of the radiation without additional mechanical tools like choppers. The thermal radiation source is excited by a pulsed electrical voltage and is thermally separated from the carrier substrate. Miniaturisation, cost reduction and economy of scale can be realized by applying the silicon on insulator (SOI) technology in combination with KOH-etching. In order to reach the maximum performance in the operation-relevant wavelength range over 8 µm, a coupled field simulation of the electro-thermal heating and the transient thermal behaviour considering thermal conduction, convection and radiation was performed. With respect to the required long term reliability of the emitter, the mechanical stability of the component was investigated and improved by additional structure-mechanical modelling and calculations of the electric current density of the heating structure to avoid electro migration effects. The advantageous reliability properties of the new designs were validated by experimental tests performed on prototype samples.
{"title":"Thermal and mechanical design optimisation of a micro machined mid-infrared emitter for optical gas sensing systems","authors":"F. Naumann, M. Ebert, J. Hildenbrand, E. Moretton, C. Peter, J. Wollenstein","doi":"10.1109/ESIME.2009.4938448","DOIUrl":"https://doi.org/10.1109/ESIME.2009.4938448","url":null,"abstract":"The numerical pre-design of a novel micro-machined thermal infrared emitter, using a spider type hotplate concept is presented. The spider concept introduced allows the fast transient operation of the emitter and thus a direct modulation of the radiation without additional mechanical tools like choppers. The thermal radiation source is excited by a pulsed electrical voltage and is thermally separated from the carrier substrate. Miniaturisation, cost reduction and economy of scale can be realized by applying the silicon on insulator (SOI) technology in combination with KOH-etching. In order to reach the maximum performance in the operation-relevant wavelength range over 8 µm, a coupled field simulation of the electro-thermal heating and the transient thermal behaviour considering thermal conduction, convection and radiation was performed. With respect to the required long term reliability of the emitter, the mechanical stability of the component was investigated and improved by additional structure-mechanical modelling and calculations of the electric current density of the heating structure to avoid electro migration effects. The advantageous reliability properties of the new designs were validated by experimental tests performed on prototype samples.","PeriodicalId":225582,"journal":{"name":"EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130265840","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-04-26DOI: 10.1109/ESIME.2009.4938466
Masafumi Sano, C. Chou, T. Hung, Shin-Yueh Yang, K. Chiang
The Board level drop test is intended to evaluate and compare the drop performance of surface mount electronic components. The JEDEC standardize for board level drop test address test board construction, design, material, component locations and test conditions etc. However, in actual drop test conditions, continued drops usually loosen up the mounting screw, which is not considered in JEDEC. This situation may cause the poor repeatability of the experiment. The uncertainty condition of the screw may consequently influence the dynamic behavior of the printed circuit board (PCB) assembly. Accordingly, the drop induced stress in solder joints may be influenced by the tightness of the screw The objective of this research is to study the uncertainty of the screw condition in relation to the dynamic response on the board level drop test by LS-DYNA3D. Both drop test experiments and dynamic simulation are executed. The modified input-G method, which considered the residuals of screw, was proposed to discuss the uncertainty of screw condition. Residual stress is applied in the tight screw condition. The result shows that a loose screw condition has higher first vibration amplitude of strain, and the vibration frequency is smaller than in a tight screw condition. It is also found that the chip scale package under the loose screw condition has worse reliability in the of drop test due to higher vibration magnitude.
{"title":"Uncertainty and reliability analysis of chip scale package subjected to Board-level Drop test","authors":"Masafumi Sano, C. Chou, T. Hung, Shin-Yueh Yang, K. Chiang","doi":"10.1109/ESIME.2009.4938466","DOIUrl":"https://doi.org/10.1109/ESIME.2009.4938466","url":null,"abstract":"The Board level drop test is intended to evaluate and compare the drop performance of surface mount electronic components. The JEDEC standardize for board level drop test address test board construction, design, material, component locations and test conditions etc. However, in actual drop test conditions, continued drops usually loosen up the mounting screw, which is not considered in JEDEC. This situation may cause the poor repeatability of the experiment. The uncertainty condition of the screw may consequently influence the dynamic behavior of the printed circuit board (PCB) assembly. Accordingly, the drop induced stress in solder joints may be influenced by the tightness of the screw The objective of this research is to study the uncertainty of the screw condition in relation to the dynamic response on the board level drop test by LS-DYNA3D. Both drop test experiments and dynamic simulation are executed. The modified input-G method, which considered the residuals of screw, was proposed to discuss the uncertainty of screw condition. Residual stress is applied in the tight screw condition. The result shows that a loose screw condition has higher first vibration amplitude of strain, and the vibration frequency is smaller than in a tight screw condition. It is also found that the chip scale package under the loose screw condition has worse reliability in the of drop test due to higher vibration magnitude.","PeriodicalId":225582,"journal":{"name":"EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"143 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134413953","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-04-26DOI: 10.1109/ESIME.2009.4938408
J. Zaal, W. V. van Driel, J. V. van Beek, G.Q. Zhang
In the growing MEMS market Wafer Level Thin Film Packages can be applied to an increasing number of MEMS devices. This paper discusses the effects of common assembly processes on wafer level thin film packages. All assembly processes are discussed and the effects of the process on the structures is presented. From the assembly tests the grinding process poses the largest hazards followed by dicing, moulding, wire bonding and finally die attachment. A number of improvements related to etch holes and sealing structures are proposed to enhance the crack resistance and robustness.
{"title":"Assaembly induced failures in thin film MEMS packages","authors":"J. Zaal, W. V. van Driel, J. V. van Beek, G.Q. Zhang","doi":"10.1109/ESIME.2009.4938408","DOIUrl":"https://doi.org/10.1109/ESIME.2009.4938408","url":null,"abstract":"In the growing MEMS market Wafer Level Thin Film Packages can be applied to an increasing number of MEMS devices. This paper discusses the effects of common assembly processes on wafer level thin film packages. All assembly processes are discussed and the effects of the process on the structures is presented. From the assembly tests the grinding process poses the largest hazards followed by dicing, moulding, wire bonding and finally die attachment. A number of improvements related to etch holes and sealing structures are proposed to enhance the crack resistance and robustness.","PeriodicalId":225582,"journal":{"name":"EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"448 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124280153","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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