Modelling of process and reliability of press-fit interconnections

EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2009-04-26 DOI:10.1109/ESIME.2009.4938502

T. Fellner, E. Zukowski, J. Wilde

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引用次数: 5

Abstract

This investigation is aimed at the stability of press-fit interconnections for MID. Moulded Interconnect Devices (MID) are 3-dimensional substrates produced by thermoplastic injection moulding for large-series applications. The assembly process of press-fit interconnections has been correctly modelled with a FE-Software. With this model the behaviour of the mechanical contact pressure, which decreases due to creep in the thermoplastic base material, could be described. Especially, the modelling is a tool to optimize pin and hole geometries. In order to obtain realistic results, the creep law parameters for the applied base material, a liquid-crystal polymer (LCP), was fitted to experimental. The required coefficients of friction were determined by adapting the simulations to the experiments. The time-dependent retention force between a pin and the substrate directly after assembly or after temperature loads could be predicted with finite element analyses, which was used as reliability criterion.

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压合互连过程建模及可靠性研究

本研究旨在研究MID压合互连的稳定性。模压互连器件(MID)是通过热塑性注塑成型生产的用于大系列应用的三维基板。用有限元软件对压合接头的装配过程进行了正确的建模。使用该模型，可以描述由于热塑性基材蠕变而降低的机械接触压力的行为。特别是，该模型是优化销孔几何形状的工具。为了得到真实的结果，对所应用的基材液晶聚合物(LCP)的蠕变规律参数进行了拟合。通过模拟与实验相适应，确定了所需的摩擦系数。在装配后或温度载荷作用下，销与衬底之间随时间变化的保持力可用有限元分析预测，并以此作为可靠性准则。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

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