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Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium

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Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium

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Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium - 最新文献

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CSP solder ball reliability

Pub Date : 1997-10-13 DOI: 10.1109/IEMT.1997.626961 M. Ikemizu, Y. Fukuzawa, J. Nakano, T. Yokoi, K. Miyajima, H. Funakura, E. Hosomi

Rheological techniques for measuring normal stress differences of solder paste [PCBs]

Pub Date : 1997-10-13 DOI: 10.1109/IEMT.1997.626897 M. Riedlin, Nduka Nnamdi (Ndy) Ekere

A two-stage hybrid with uniform machines and setup times

Pub Date : 1997-10-13 DOI: 10.1109/IEMT.1997.626954 Wanzhen Huang, Shanling Li
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