CSP solder ball reliability

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium Pub Date : 1997-10-13 DOI:10.1109/IEMT.1997.626961

M. Ikemizu, Y. Fukuzawa, J. Nakano, T. Yokoi, K. Miyajima, H. Funakura, E. Hosomi

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引用次数: 5

Abstract

The solder joint reliability for Chip Scale Package (CSP) as assembled on Printed Circuit Board (PCB) is believed to be poorer than that for QFP. The main cause of this poor reliability is the Coefficient of Thermal Expansion (CTE) mismatch between CSP and PCB. With a view to implement CSP into practical board assembly without underfill, we performed experimental study and FEM analysis of solder joint reliability for three different CSPs, among which two were ceramic fine-pitched ball grid arrays (C-FBGAs) and one plastic package (P-FBGA). We found that solder ball life predictions from the FEM analysis coupled with Coffin-Manson's equation were in good agreement with results from reliability experiments for C-FBGA (high-a) and P-FBGA, whereas difference between them was observed in the case of C-FBGA (Al/sub 2/O/sub 3/). Among three CSPs, P-FBGA turned out to have excellent solder fatigue life and there is the prospect it can be implemented in board assembly without underfill.

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CSP焊球可靠性

芯片级封装(CSP)在印刷电路板(PCB)上组装时的焊点可靠性被认为比QFP要差。这种可靠性差的主要原因是CSP和PCB之间的热膨胀系数(CTE)不匹配。为了将CSP应用于无底填充的实际电路板组装中，我们对三种不同CSP的焊点可靠性进行了实验研究和有限元分析，其中两种是陶瓷细斜球栅阵列(c - fbga)和一种塑料封装(P-FBGA)。我们发现，结合Coffin-Manson方程的有限元分析得出的焊料球寿命预测与C-FBGA(高a)和P-FBGA的可靠性实验结果吻合良好，而C-FBGA (Al/sub 2/O/sub 3/)的可靠性实验结果存在差异。在三种csp中，P-FBGA具有优异的焊料疲劳寿命，有望在无欠填充的电路板组装中实现。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium

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