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2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems

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2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems

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2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems - 最新文献

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High-frequency through-silicon Via (TSV) failure analysis

Pub Date : 2011-12-12 DOI: 10.1109/EPEPS.2011.6100237 Joohee Kim, Jonghyun Cho, J. Pak, Joungho Kim, J. Yook, J. C. Kim

Early stage chip/package/board co-design techniques for system-on-chip

Pub Date : 2011-12-12 DOI: 10.1109/EPEPS.2011.6100175 M. Tanaka, M. Toyama, Ryo Mori, H. Nakashima, M. Haida, I. Ooshima

SI-aware layout and equalizer design to enhance performance of high-speed links in blade servers

Pub Date : 2011-12-12 DOI: 10.1109/EPEPS.2011.6100226 Yung-Shou Cheng, Hsin-Hung Lu, Michael Chang, Stephen Chang, Bob Liu, R. Wu
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