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2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)

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2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)

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2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) - 最新文献

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Reliability Optimisation and Lifetime Modelling of micro-BGA Assemblies in Harsh Environment Applications

Pub Date : 2021-09-13 DOI: 10.23919/empc53418.2021.9584970 S. Stoyanov, P. Stewart, C. Bailey

Assembly of MEMS micro mirrors pair system in a single module

Pub Date : 2021-09-13 DOI: 10.23919/empc53418.2021.9584995 M. D. Sarto, L. Maggi, A. Gritti, A. Maierna, D. Terzi, R. Carminati

Low-temperature Metal Bonding for Optical Device Packaging

Pub Date : 2021-09-13 DOI: 10.23919/empc53418.2021.9585007 O. Golim, V. Vuorinen, N. Tiwary, R. Glenn, M. Paulasto-Kröckel
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