2013 IEEE International Interconnect Technology Conference - IITC

Early screening method of chip-package interaction for multi-layer Cu/low-k structure using high load indentation test

Pub Date : 2013-09-30 DOI: 10.1109/IITC.2013.6615568 T. Usami, Tomoyuki Nakamura, I. Yashima

Tier-independent microfluidic cooling for heterogeneous 3D ICs with nonuniform power dissipation

Pub Date : 2013-06-13 DOI: 10.1109/IITC.2013.6615561 Yue Zhang, Li Zheng, M. Bakir

Investigations on partially filled HAR tsvs for MEMS applications

Pub Date : 2013-06-13 DOI: 10.1109/IITC.2013.6615585 L. Hofmann, I. Schubert, K. Gottfried, S. Schulz, T. Gessner