Investigating the Effect of Solder Material Quantity on Obtaining Strong Solder Joints in LGA Type Assembly Using Statistics

Abstract

The article examines and analyzes the results of the research done on the strength of solders of LGA (Land Grid Array) assembly type at different amounts of soldering material and using Hot bar soldering technology. Experiments are described for achieving the maximum tensile strength of soldered pads on a flexible circuit board (FPC) to a standard rigid circuit board (PCB) at different amounts of solder by Hot bar soldering. The method of measuring the amount of solder material is specified and the setup for measuring solder height is described. The soldering system of flexible and rigid board is applied and the studied pads are described. The intelligent breaking force measurement system and validation through MSA (Measurement System Analysis) is also presented. Through a statistical method SPC (Statistical Process Control) a specific analysis was performed and conclusions were generated for the investigated system. A prescription is made for the amount of soldering material at which the maximum breaking strength of the solders is obtained for a particular application. The paper finishes with a conclusion for future work to obtain better results for solder rupture strength.