D. Andersson, S. Kristiansson, L. Svensson, P. Larsson-Edefors, K. Jeppson
{"title":"Noise Interaction Between Power Distribution Grids and Substrate","authors":"D. Andersson, S. Kristiansson, L. Svensson, P. Larsson-Edefors, K. Jeppson","doi":"10.1109/ISQED.2008.147","DOIUrl":null,"url":null,"abstract":"We have investigated the interaction between power delivery and substrate coupling in terms of noise. From our results, we identify that an increased density of substrate contacts does not to any significance decrease noise on the power supply lines. However, the current injected into the substrate is highly dependent on higher-level grid/package inductance and substrate contact density. We have derived statistically that substrate noise variations could be related to these two design parameters to 69.75%. Based on linear fitting, a model that describes the injected current as function of substrate contact density and power delivery inductance is developed.","PeriodicalId":243121,"journal":{"name":"9th International Symposium on Quality Electronic Design (isqed 2008)","volume":"56 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-03-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"9th International Symposium on Quality Electronic Design (isqed 2008)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISQED.2008.147","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
We have investigated the interaction between power delivery and substrate coupling in terms of noise. From our results, we identify that an increased density of substrate contacts does not to any significance decrease noise on the power supply lines. However, the current injected into the substrate is highly dependent on higher-level grid/package inductance and substrate contact density. We have derived statistically that substrate noise variations could be related to these two design parameters to 69.75%. Based on linear fitting, a model that describes the injected current as function of substrate contact density and power delivery inductance is developed.
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