Magnetically Actuated Test Method for Interfacial Fracture Reliability Assessment

Rui Chen, N. Ginga, S. Sitaraman
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引用次数: 1

Abstract

The interfacial strength of different thin film layers is critical for the reliability of electronic devices. With the continuing trend of decreasing dimensions of various features and layers in microelectronics, the limitations of the methods used to test their mechanical behavior are becoming apparent. Smaller microelectronic device dimensions require the fabrication and attachment of smaller fixtures to the device samples to apply mechanical loads, and at such small length scales, fabrication and attachment of appropriately small fixtures have become difficult. Additionally, testing of smaller devices requires similarly small, but accurate, control and measurement of forces and the resulting displacements. Thus, novel test methods are needed for mechanical reliability testing of next-generation microelectronic devices. In this paper, a magnetically actuated method to mechanically test features and layers in microelectronics is presented and examined. This method uses magnetic forces to initiate and propagate mechanical failures in the interfaces of a microelectronic structure using a fixtureless and contactless technique. In the test, a permanent magnet is attached to the surface of the tested microelectronic structure. The tested sample with the permanent magnet is then placed in an external electromagnetic field which applies a localized force to be able to initiate and propagate interfacial delamination. Different loading magnitudes and profiles can be created by adjusting the applied voltage of the external electromagnetic field. Thus, both monotonic and fatigue loading conditions can be achieved using the proposed test technique. Furthermore, tensile, shear, and mixed loading conditions can be facilitated by changing the location and orientation of the externally applied electromagnetic field. Numerical simulations, in combination with experiments, are used to determine the forces induced on the die pads through the external electromagnetic field on the permanent magnet. The force on the permanent magnet is then used to examine interfacial crack propagation between different layers, and to demonstrate the viability of the proposed test technique.
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界面断裂可靠性评估的磁驱动试验方法
不同薄膜层的界面强度对电子器件的可靠性至关重要。随着微电子中各种特征和层的尺寸不断减小,用于测试其力学行为的方法的局限性日益明显。较小的微电子设备尺寸要求在设备样品上制造和附加较小的夹具以施加机械载荷,并且在如此小的长度尺度上,制造和附加适当的小夹具变得困难。此外,测试较小的设备需要同样小,但准确的控制和测量力和由此产生的位移。因此,新一代微电子器件的机械可靠性测试需要新的测试方法。本文提出并研究了一种磁致驱动的方法来机械测试微电子器件的特征和层。该方法采用无固定和无接触技术,利用磁力在微电子结构的界面中启动和传播机械故障。在测试中,将永磁体附着在被测微电子结构的表面。然后将带有永磁体的测试样品置于外部电磁场中,该电磁场施加局域力以能够启动和传播界面分层。通过调节外加电磁场的电压,可以产生不同的载荷大小和形状。因此,使用所提出的测试技术可以实现单调和疲劳加载条件。此外,通过改变外加电磁场的位置和方向,可以促进拉伸、剪切和混合加载条件。采用数值模拟和实验相结合的方法,确定了外加电磁场作用在永磁体上对模垫产生的力。然后使用永磁体上的力来检查不同层之间的界面裂纹扩展,并证明所提出的测试技术的可行性。
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