Mechanical Behavior of Lead-free Solder at High Temperatures and High Strain Rates

Abstract

While moving ahead with science and technology., the service conditions of microelectronic devices are becoming more and more complicated., and the performance requirements of packaging materials are also increasing especially for hash applications. The dependability of solder joints in electronic chips under high temperatures and high strain rates have attracted much attention. In this paper., experimental studies are carried out on the dynamic behavior of Sn-3.0Ag-0.5Cu (SAC305) materials. The dynamic compression experiments are operated by using the Split-Hopkinson Pressure Bar (SHPB) with a heating furnace to achieve the target temperature condition. The true stress- strain curves are received by this system at a temperature of 343K and the strain rates from 959 ${\mathrm{s}^{-1}}$ to ${1961\ {\mathrm{s}^{-1}}}$. Additionally., in order to investigate the deformation mechanism under impact scenarios., an optical microscopy is utilized to characterize the microstructure of the SAC305 lead-free solder specimen at high temperatures and high strain rates.