Moisture determination in hermetic IC packages by the dew point method using AC capacitance and conductance measurement

J. Sosniak, B. A. Unger
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Abstract

The dew point in ceramic packages is shown to be observable by ac phase-sensitive measurement of the real and imaginary parts of the dielectric constant of an air gap capacitor. Only the package surface directly under the sensor is cooled, enhancing the sensitivity by preferential condensation. The dew point response peak is followed by a sharp drop due to interface freezing phenomena. Milligrams of liquid water had to be placed in the packages before sealing with epoxy at 175°C for dew points above -20°C to been seen. Large amounts of water were thus eliminated even at this moderate temperature.
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用交流电容和电导测量露点法测定密封IC封装中的水分
通过对气隙电容器介电常数实部和虚部的交流相敏测量,可以观察到陶瓷封装中的露点。只有传感器正下方的封装表面被冷却,通过优先冷凝来提高灵敏度。由于界面冻结现象,露点响应峰后出现急剧下降。在175°C用环氧树脂密封之前,必须在包装中放入数毫克的液态水,以观察露点高于-20°C的露点。因此,即使在这种温和的温度下,大量的水也被排除了。
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