Numerical Simulation for Flow Boiling in Microchannels with Different Pin Fin Arrays

Abstract

The rapid development of technology in the past years brings unprecedent challenges in the cooling of electronic devices. Densely packed electronic systems require more efficient ways to dissipate the heat generated by the electronic components. The present study develops a numerical model to investigate flow boiling in micro-channels. Volume of Fluid method is adopted to capture the interface between the liquid and vaporized gas. The results from the developed model are validated against the existing published data. Upon this achieved, we then applied the model to simulate flow boiling in micro-channels with different pin-fin structures. The effects of pitch for the pin-fins are investigated and the optimized design of pin-fin structure is proposed. (“p134.doc”)