{"title":"Volume Implementation of MCM-D Based Cache SRAM Products for Workstation and PC Applications","authors":"S. Mok","doi":"10.1109/ICMCM.1994.753569","DOIUrl":null,"url":null,"abstract":"Multichip modules have been used in large numbers of memory applications for over ten years. This paper outlines the use of MCM-D in a high-performance family of SRAM modules designed to take advantage of a number of recent changes in the MCM infrastructure. The products are designed for high volume, high-performance, relatively cost-sensitive insertions in support of current and next-generation microprocessor-based system families. This paper discusses the design and implementation of MicroModule System's ChipFrame cache SRAMS. Included are a discussion of package alternatives reviewed prior to standardization on 28mm 160-lead PQFP, the test strategies employed by both IC suppliers and the MCM foundry, and a summary of reliability programs used in product development and design verification. The discussion will also include sample system implementations using these MCMs.","PeriodicalId":363745,"journal":{"name":"Proceedings of the International Conference on Multichip Modules","volume":"11 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-04-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the International Conference on Multichip Modules","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMCM.1994.753569","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
Multichip modules have been used in large numbers of memory applications for over ten years. This paper outlines the use of MCM-D in a high-performance family of SRAM modules designed to take advantage of a number of recent changes in the MCM infrastructure. The products are designed for high volume, high-performance, relatively cost-sensitive insertions in support of current and next-generation microprocessor-based system families. This paper discusses the design and implementation of MicroModule System's ChipFrame cache SRAMS. Included are a discussion of package alternatives reviewed prior to standardization on 28mm 160-lead PQFP, the test strategies employed by both IC suppliers and the MCM foundry, and a summary of reliability programs used in product development and design verification. The discussion will also include sample system implementations using these MCMs.