A monolithic three-axis silicon capacitive accelerometer with micro-g resolution

J. Chae, H. Kulah, K. Najafi
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引用次数: 39

Abstract

A monolithic three-axis silicon capacitive accelerometer utilizing a combined surface and bulk micromachining technology is demonstrated with micro-g resolution. The accelerometer consists of three individual single-axis accelerometers. All three devices have full-wafer thick silicon proof-mass, large area polysilicon sense/drive electrodes, and small sensing gap (<1.5 /spl mu/m) formed by a sacrificial oxide layer. The fabricated accelerometer system is 7/spl times/9 mm/sup 2/ in size, has >5pF/g measured sensitivity and sub-/spl mu/g//spl radic/Hz mechanical noise floor for all three axes. The total measured noise floor of the accelerometer hybrid assembled with CMOS interface circuit is 1.60 /spl mu/g//spl radic/Hz, 1.08 /spl mu/g//spl radic/Hz for in-plane and out-of-plane devices, respectively.
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具有微加速度分辨率的单片三轴硅电容加速度计
采用表面微加工和本体微加工相结合的技术,研制了一种具有微分辨率的单片三轴硅电容加速度计。加速度计由三个独立的单轴加速度计组成。这三种器件都具有全晶圆厚的防硅质量,大面积多晶硅感测/驱动电极,以及小的感测间隙(5pF/g测量灵敏度和亚/spl μ /g//spl径向/Hz机械噪声底限)。采用CMOS接口电路组装的混合加速度计的实测噪声本底为1.60 /spl μ /g//spl径向/Hz,面内器件和面外器件的噪声本底分别为1.08 /spl μ /g//spl径向/Hz。
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