Xiang Li, Daohui Li, Fang Qi, M. Packwood, H. Luo, Guoyou Liu, Yangang Wang, X. Dai
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引用次数: 2
Abstract
An advanced electro-thermal analysis approach is introduced in this paper. The method is based on the reduced order modelling technique in which the zero dimensional (0D) thermal network is extracted from the three dimensional (3D) IGBT module packaging structure and dynamically coupled with the electro-thermal model of the chips. By this multi-physics coupling technique, the electro-thermal behaviour of the IGBT module can be revealed with much more details, with potential for accurate reliability assessment. The circuit-fashion analysis approach also helps to greatly reduce the computational time and resource required. The schematic, simulation and validation of the approach will be described in detail.
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