2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)最新文献
Pub Date : 2019-03-24DOI: 10.1109/EUROSIME.2019.8724555
Bo Sun, Jiajie Fan, Xuejun Fan, Guoqi Zhang
In this work, a SPICE-based transient thermal-electronic simulation model of LEDs with consideration of transient temperature is developed. A RC network is used to simulate the thermal compact model, which voltage distribution equals to thermal compact model’s temperature distribution numerically. Voltage and current dependent current sources are used as sources of heat and light. A non-linear dependent source is used to simulate LED’s AC behavior. Thermal model and optical model can be integrated with the LED’s electronic model. Iteration processes for calculations of electronic-thermal-optical coupling effects can be carried out by the SPICE solver automatically without convergence problem. A selected type of LEDs is measured in different temperature and current levels to verify the proposed model. It has been found that electronic, thermal and optical parameters have good agreement with testing results. Values of major parameters in the propose model have been extracted.
{"title":"A SPICE-based Transient Thermal-Electronic Model for LEDs","authors":"Bo Sun, Jiajie Fan, Xuejun Fan, Guoqi Zhang","doi":"10.1109/EUROSIME.2019.8724555","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724555","url":null,"abstract":"In this work, a SPICE-based transient thermal-electronic simulation model of LEDs with consideration of transient temperature is developed. A RC network is used to simulate the thermal compact model, which voltage distribution equals to thermal compact model’s temperature distribution numerically. Voltage and current dependent current sources are used as sources of heat and light. A non-linear dependent source is used to simulate LED’s AC behavior. Thermal model and optical model can be integrated with the LED’s electronic model. Iteration processes for calculations of electronic-thermal-optical coupling effects can be carried out by the SPICE solver automatically without convergence problem. A selected type of LEDs is measured in different temperature and current levels to verify the proposed model. It has been found that electronic, thermal and optical parameters have good agreement with testing results. Values of major parameters in the propose model have been extracted.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114762669","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-03-24DOI: 10.1109/EUROSIME.2019.8724567
Zeyu Wu, Zili Wang, C. Qian, Bo Sun, Yi Ren, Qiang Feng, Dezhen Yang
The prediction of remaining useful life (RUL) of lithium-ion batteries is an essential part of the prognostics and health management (PHM) for electric vehicles (EVs). The conventional method to estimate the RUL of batteries based on offline laboratory experiment data may give rise to a considerable amount of error by ignoring the uncertainties occurred in random charge-discharge cycles under operation. To overcome this problem, an online prognostic method based on a gamma process model was presented, and verified by using the experimental data from a set of four batteries test with random discharge recorded by National Aeronautics and Space Administration (NASA). In addition, the probability density function (PDF) and the reliability curve of the batteries were established along with the 0.95 confidence interval to reveal the statistical profile of predicted RULs. Compared to the conventional RUL prediction methods, the proposed method merely requires a small quantity of training data to achieve accurate RUL prediction for randomized usage batteries on EVs.
{"title":"Online prognostication of remaining useful life for random discharge lithium-ion batteries using a gamma process model","authors":"Zeyu Wu, Zili Wang, C. Qian, Bo Sun, Yi Ren, Qiang Feng, Dezhen Yang","doi":"10.1109/EUROSIME.2019.8724567","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724567","url":null,"abstract":"The prediction of remaining useful life (RUL) of lithium-ion batteries is an essential part of the prognostics and health management (PHM) for electric vehicles (EVs). The conventional method to estimate the RUL of batteries based on offline laboratory experiment data may give rise to a considerable amount of error by ignoring the uncertainties occurred in random charge-discharge cycles under operation. To overcome this problem, an online prognostic method based on a gamma process model was presented, and verified by using the experimental data from a set of four batteries test with random discharge recorded by National Aeronautics and Space Administration (NASA). In addition, the probability density function (PDF) and the reliability curve of the batteries were established along with the 0.95 confidence interval to reveal the statistical profile of predicted RULs. Compared to the conventional RUL prediction methods, the proposed method merely requires a small quantity of training data to achieve accurate RUL prediction for randomized usage batteries on EVs.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"80 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134140076","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-03-24DOI: 10.1109/EUROSIME.2019.8724522
K. Weide-Zaage, A. Guédon-Gracia, H. Frémont
Most reliability or qualification tests focus on a single type of failure mechanism, whereas in the field, the devices are submitted to sequential and superimposed loads. In this paper, the influence on electromigration sensitivity due to corrosion of SAC solder joints is evaluated by finite element simulations. In comparison to new solder joints, the corroded zones induce a change in the weakest part location. Moreover, the maximum electromigration mass flux divergence of corroded bumps is approximately 35% higher than the normal solder bump, which means the electromigration performance is getting worse because of the corrosion. Moreover, the thermomigration effect is also worsened by the corrosion.
{"title":"Electromigration Effects in Corroded BGA","authors":"K. Weide-Zaage, A. Guédon-Gracia, H. Frémont","doi":"10.1109/EUROSIME.2019.8724522","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724522","url":null,"abstract":"Most reliability or qualification tests focus on a single type of failure mechanism, whereas in the field, the devices are submitted to sequential and superimposed loads. In this paper, the influence on electromigration sensitivity due to corrosion of SAC solder joints is evaluated by finite element simulations. In comparison to new solder joints, the corroded zones induce a change in the weakest part location. Moreover, the maximum electromigration mass flux divergence of corroded bumps is approximately 35% higher than the normal solder bump, which means the electromigration performance is getting worse because of the corrosion. Moreover, the thermomigration effect is also worsened by the corrosion.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"195 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114865097","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-03-24DOI: 10.1109/EUROSIME.2019.8724561
M. Seidl, M. Gehring, U. Krumbein, G. Schrag
The emerging lab-on-chip technology for in-situ medical use and environmental surveillance brought with it the demand for new, micro-scale actuator designs specialized in energy-efficient fluid transport, supporting the development of lightweight and mobile systems. In this work, we present the simulation-based design of a novel, integrated micro-fluidic actuator intended for mobile applications. The design is laid-out to be compatible with standard semiconductor manufacturing processes in order to enable mass-production at low cost per unit. The development of the device is supported and accelerated by a dedicated fully energy-coupled finite element model (FEM). The FE model takes into account the fluid-solid interaction in addition to the electro-mechanical interrelations, therefore reproducing the full device behavior in reaction to electrical input signals. In the end, we discuss several design parameters exhibiting space for improvement compared to the chosen standard values, as identified by the FEM simulations.
{"title":"Simulation-Based Design of an Electrostatically Driven Micro-Actuator for Fluid Transport in Mobile Applications","authors":"M. Seidl, M. Gehring, U. Krumbein, G. Schrag","doi":"10.1109/EUROSIME.2019.8724561","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724561","url":null,"abstract":"The emerging lab-on-chip technology for in-situ medical use and environmental surveillance brought with it the demand for new, micro-scale actuator designs specialized in energy-efficient fluid transport, supporting the development of lightweight and mobile systems. In this work, we present the simulation-based design of a novel, integrated micro-fluidic actuator intended for mobile applications. The design is laid-out to be compatible with standard semiconductor manufacturing processes in order to enable mass-production at low cost per unit. The development of the device is supported and accelerated by a dedicated fully energy-coupled finite element model (FEM). The FE model takes into account the fluid-solid interaction in addition to the electro-mechanical interrelations, therefore reproducing the full device behavior in reaction to electrical input signals. In the end, we discuss several design parameters exhibiting space for improvement compared to the chosen standard values, as identified by the FEM simulations.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130149704","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-03-24DOI: 10.1109/EUROSIME.2019.8724587
F. Wagner, Y. Maniar, M. Rittner, S. Kaessner, M. Guyenot, Lukas Lang, B. Wunderle
The need for small, high efficient (98%) and high temperature capable $(200^{circ}{rm{C}})$ power electronics lead to the development of SiC-power modules, which can satisfy these advanced requirements. Power electronics have often to resist harsh environments and provide high reliability. A typical way to fulfill these demands is the application of silicone gels and mold compounds, which can be used up to $200^{circ}{rm{C}}$. In order to protect power electronics for application at higher temperature up to $250^{circ}{rm{C}}$ and overcome the low thermal conductivity of polymer encapsulates new ceramic compounds were developed. Hence they are new to the market, there are less experiences using this compounds to increase reliability of SiC power modules. The aim of this study is to compare the effect of organic mold compounds and ceramic compound encapsulates onto a single chip SiC power module with finite element modeling (FEM) of power cycling loads. With the used assembly and interconnection technologies (AIT) such as active metal brazed (AMB) ceramics, silver sintering and Al|Cu-ribbon bond hybrids, the expected failure is a ribbon bond-lift off. The focus is therefore on the elastic and plastic deformation in the ribbon bond foots. As the stiffness of the encapsulate increases, the strain in the ribbon bonds can be reduced significantly. This allows a significant increase in reliability and lifetime, if the encapsulation does not introduce new failure mechanism. Through a comparison of FEM-results to experimental tested samples, the simulations are validated and a lifetime prediction is made.
{"title":"Simulative Comparison of Polymer and Ceramic Encapsulation on SiC-MOSFET Power Modules under Thermomechanical Load","authors":"F. Wagner, Y. Maniar, M. Rittner, S. Kaessner, M. Guyenot, Lukas Lang, B. Wunderle","doi":"10.1109/EUROSIME.2019.8724587","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724587","url":null,"abstract":"The need for small, high efficient (98%) and high temperature capable $(200^{circ}{rm{C}})$ power electronics lead to the development of SiC-power modules, which can satisfy these advanced requirements. Power electronics have often to resist harsh environments and provide high reliability. A typical way to fulfill these demands is the application of silicone gels and mold compounds, which can be used up to $200^{circ}{rm{C}}$. In order to protect power electronics for application at higher temperature up to $250^{circ}{rm{C}}$ and overcome the low thermal conductivity of polymer encapsulates new ceramic compounds were developed. Hence they are new to the market, there are less experiences using this compounds to increase reliability of SiC power modules. The aim of this study is to compare the effect of organic mold compounds and ceramic compound encapsulates onto a single chip SiC power module with finite element modeling (FEM) of power cycling loads. With the used assembly and interconnection technologies (AIT) such as active metal brazed (AMB) ceramics, silver sintering and Al|Cu-ribbon bond hybrids, the expected failure is a ribbon bond-lift off. The focus is therefore on the elastic and plastic deformation in the ribbon bond foots. As the stiffness of the encapsulate increases, the strain in the ribbon bonds can be reduced significantly. This allows a significant increase in reliability and lifetime, if the encapsulation does not introduce new failure mechanism. Through a comparison of FEM-results to experimental tested samples, the simulations are validated and a lifetime prediction is made.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"68 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121075962","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-03-24DOI: 10.1109/EUROSIME.2019.8724556
A. Kozlov
Thermal processes in three type of thin-film bulk acoustic wave resonator, such as a resonator with an air gap, a membrane-type resonator and a resonator with a Bragg acoustic reflector, are considered. In the structures of the resonators the 2D domains of modeling are marked out. For the resonator with an air gap and the membrane-type resonator the 2D domain of modeling is in the plane of its piezoelectric transducer. For the resonator with a Bragg acoustic reflector the 2D domain of modeling is in the plane perpendicular to that of the piezoelectric transducer. The domains of modeling of the resonators are divided into the regions. For each region, the stationary heat deferential equation and the boundary conditions are defined and then this equation is solved using eigenfunction method. The heat flux densities between the regions included in the solution are presented as the sums of orthogonal functions with unknown weighting coefficients. These coefficients are found using the adjoint boundary conditions. The presented approach was used to analyze the thermal processes in the above mentioned three types of the thin-film bulk acoustic wave resonators with piezoelectric transducers based on aluminum nitride. The overheating temperature distribution in the piezoelectric transducer of each resonator and the dependence of the weighted average overheating temperature of this transducer on the dissipated power are determined.
{"title":"Modeling of Thermal Processes in Thin-Film BAW Resonators","authors":"A. Kozlov","doi":"10.1109/EUROSIME.2019.8724556","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724556","url":null,"abstract":"Thermal processes in three type of thin-film bulk acoustic wave resonator, such as a resonator with an air gap, a membrane-type resonator and a resonator with a Bragg acoustic reflector, are considered. In the structures of the resonators the 2D domains of modeling are marked out. For the resonator with an air gap and the membrane-type resonator the 2D domain of modeling is in the plane of its piezoelectric transducer. For the resonator with a Bragg acoustic reflector the 2D domain of modeling is in the plane perpendicular to that of the piezoelectric transducer. The domains of modeling of the resonators are divided into the regions. For each region, the stationary heat deferential equation and the boundary conditions are defined and then this equation is solved using eigenfunction method. The heat flux densities between the regions included in the solution are presented as the sums of orthogonal functions with unknown weighting coefficients. These coefficients are found using the adjoint boundary conditions. The presented approach was used to analyze the thermal processes in the above mentioned three types of the thin-film bulk acoustic wave resonators with piezoelectric transducers based on aluminum nitride. The overheating temperature distribution in the piezoelectric transducer of each resonator and the dependence of the weighted average overheating temperature of this transducer on the dissipated power are determined.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128783944","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-03-24DOI: 10.1109/EUROSIME.2019.8724553
Ayda Halouani, A. Cherouat, M. Chaabane, M. Haddar
In this paper, we propose a metamodel called generalized polynomial chaos (gPC) to investigate the stochastic response of a ball grid array (PBGA) package under thermal cycle excitation. The shear strain is extracted in the presence of uncertain material and boundary condition parameters. A non-linear thermo-mechanical using Anand viscoplastic law was studied.
{"title":"A Probabilistic approach to the robust thermo-mechanical analysis of Ball Grid Array Solder Joints","authors":"Ayda Halouani, A. Cherouat, M. Chaabane, M. Haddar","doi":"10.1109/EUROSIME.2019.8724553","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724553","url":null,"abstract":"In this paper, we propose a metamodel called generalized polynomial chaos (gPC) to investigate the stochastic response of a ball grid array (PBGA) package under thermal cycle excitation. The shear strain is extracted in the presence of uncertain material and boundary condition parameters. A non-linear thermo-mechanical using Anand viscoplastic law was studied.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122099062","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-03-24DOI: 10.1109/EUROSIME.2019.8724549
Z. Qu, Hongyu Tang, H. Ye, Xuejun Fan, Guoqi Zhang
Two-dimensional transition-metal dichalcogenides (TMDCs) such as MoS2 are potential channel materials for thin film transistor. Here, we report the effects of strain on the performance of the back-gated few-layer MoS2 thin film transistors (FL-MoS2 TFTs) with poly(acrylic acid) (PAA) dielectric layer. The devices exhibit high on/off ratio of 5600 and mobility of 7.07 cm/Vs. The electrical and optical characterizations were affected by the strain under bending conditions. The results show that the device exhibits quite stable mobility and photoswitching behavior under different bending radius, which is owing to the high deformability of MoS2 and PAA dielectric layer. Big bending radius enable improved photoresponsitivity due to the change of band gap of MoS2. The excellent bending performance of FL-MoS2 transistor presents potential applications in flexible and wearable electronics and optoelectronics.
{"title":"Electrical and optical characterization of MoS2 thin film transistors and the effect of strain on their performances","authors":"Z. Qu, Hongyu Tang, H. Ye, Xuejun Fan, Guoqi Zhang","doi":"10.1109/EUROSIME.2019.8724549","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724549","url":null,"abstract":"Two-dimensional transition-metal dichalcogenides (TMDCs) such as MoS2 are potential channel materials for thin film transistor. Here, we report the effects of strain on the performance of the back-gated few-layer MoS2 thin film transistors (FL-MoS2 TFTs) with poly(acrylic acid) (PAA) dielectric layer. The devices exhibit high on/off ratio of 5600 and mobility of 7.07 cm/Vs. The electrical and optical characterizations were affected by the strain under bending conditions. The results show that the device exhibits quite stable mobility and photoswitching behavior under different bending radius, which is owing to the high deformability of MoS2 and PAA dielectric layer. Big bending radius enable improved photoresponsitivity due to the change of band gap of MoS2. The excellent bending performance of FL-MoS2 transistor presents potential applications in flexible and wearable electronics and optoelectronics.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123083993","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-03-24DOI: 10.1109/EUROSIME.2019.8724563
M. Lenczner, W. Belkhir, N. Ratier, N. Trinh, B. Cavallier
MEMSALab is a software in development that will al-low the generation of multiscale multi-physics model families based on their derivation. Here, we present a mini-language to express such models in a way that is both relatively simple and generates the tree structures necessary for derivations. For validation, it is used for the direct construction (i.e. without derivation) of a family of homogenized models of propagation of waves through an interface with periodic structure. The different models are built according to the principle of reusability based on our extension-combination method. In this respect, recent results for this method are announced.
{"title":"Automatic assembly of multiscale models and its application to a family of homogenized models of wave propagation through interfaces having a periodic structure","authors":"M. Lenczner, W. Belkhir, N. Ratier, N. Trinh, B. Cavallier","doi":"10.1109/EUROSIME.2019.8724563","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724563","url":null,"abstract":"MEMSALab is a software in development that will al-low the generation of multiscale multi-physics model families based on their derivation. Here, we present a mini-language to express such models in a way that is both relatively simple and generates the tree structures necessary for derivations. For validation, it is used for the direct construction (i.e. without derivation) of a family of homogenized models of propagation of waves through an interface with periodic structure. The different models are built according to the principle of reusability based on our extension-combination method. In this respect, recent results for this method are announced.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133273918","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-03-24DOI: 10.1109/EUROSIME.2019.8724577
Mahdi Sadeghinia, Chalukya Chincholi, A. Udyansky, A. Fischer
With advancement in Artificial intelligence, Internet of things and next generation of mobility going towards autonomous driving, the electronic control units used for power steering need to be redundant, highly reliable and intelligent. The above challenge forces design engineers to smartly enhance the electronic components with use of multiple PCB stacked one above another. PCB is one of the main parts of the control unit on whichSMD components are populated. Therefore, comprehensive knowledge of PCB dynamic behavior is important for fatigue evaluation of SMD and other electronic components.This paper discusses the mechanical dynamic responses of PCBs using different material properties, e.g. isotropic, orthotropic and PCB homogenizing properties. Simulations are carried out in Ansys to predict the PCB frequencies and mode shapes. In order to validate the simulation results, measurements are also performed to predict PCB frequencies, mode shapes and frequency response funsctions. Measurements are carried out with PSV-400 scanning laser vibrometer from Polytech and post processing of measurement data is done with help of Polytech for visualization of mode shapes.
{"title":"Effect of material properties on PCB frequencies in electronic control unit","authors":"Mahdi Sadeghinia, Chalukya Chincholi, A. Udyansky, A. Fischer","doi":"10.1109/EUROSIME.2019.8724577","DOIUrl":"https://doi.org/10.1109/EUROSIME.2019.8724577","url":null,"abstract":"With advancement in Artificial intelligence, Internet of things and next generation of mobility going towards autonomous driving, the electronic control units used for power steering need to be redundant, highly reliable and intelligent. The above challenge forces design engineers to smartly enhance the electronic components with use of multiple PCB stacked one above another. PCB is one of the main parts of the control unit on whichSMD components are populated. Therefore, comprehensive knowledge of PCB dynamic behavior is important for fatigue evaluation of SMD and other electronic components.This paper discusses the mechanical dynamic responses of PCBs using different material properties, e.g. isotropic, orthotropic and PCB homogenizing properties. Simulations are carried out in Ansys to predict the PCB frequencies and mode shapes. In order to validate the simulation results, measurements are also performed to predict PCB frequencies, mode shapes and frequency response funsctions. Measurements are carried out with PSV-400 scanning laser vibrometer from Polytech and post processing of measurement data is done with help of Polytech for visualization of mode shapes.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"67 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-03-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116948303","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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