Application-specific 3D Network-on-Chip design using simulated allocation

Pingqiang Zhou, Ping-Hung Yuh, S. Sapatnekar
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引用次数: 34

Abstract

Three-dimensional (3D) silicon integration technologies have provided new opportunities for Network-on-Chip (NoC) architecture design in Systems-on-Chip (SoCs). In this paper, we consider the application-specific NoC architecture design problem in a 3D environment. We present an efficient floorplan-aware 3D NoC synthesis algorithm, based on simulated allocation, a stochastic method for traffic flow routing, and accurate power and delay models for NoC components. We demonstrate that this method finds greatly improved topologies for various design objectives such as NoC power (average savings of 34%), network latency (average reduction of 35%) and chip temperature (average reduction of 20%).
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使用模拟分配的特定应用3D片上网络设计
三维(3D)硅集成技术为片上系统(soc)中的片上网络(NoC)架构设计提供了新的机会。在本文中,我们考虑了在三维环境中特定应用的NoC架构设计问题。基于模拟分配、交通流路由的随机方法以及NoC组件的精确功率和延迟模型,我们提出了一种高效的平面感知3D NoC合成算法。我们证明,这种方法可以大大改善各种设计目标的拓扑结构,例如NoC功耗(平均节省34%),网络延迟(平均降低35%)和芯片温度(平均降低20%)。
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Platform modeling for exploration and synthesis Application-specific 3D Network-on-Chip design using simulated allocation Rule-based optimization of reversible circuits An extension of the generalized Hamiltonian method to S-parameter descriptor systems Adaptive power management for real-time event streams
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