V. Holalkere, S. Mirano, A. Kuo, W.T. Chen, C. Sumithpibul, S. Sirinorakul
{"title":"Evaluation of plastic package delamination via reliability testing and fracture mechanics approach","authors":"V. Holalkere, S. Mirano, A. Kuo, W.T. Chen, C. Sumithpibul, S. Sirinorakul","doi":"10.1109/ECTC.1997.606206","DOIUrl":null,"url":null,"abstract":"Material delamination is a commonly encountered reliability problem with plastic surface mount devices. This paper describes a systematic procedure to assess plastic package delamination. In this procedure, the JEDEC reliability tests (EIA/JESD22-A112-A and A113-A), the finite element stress analysis, and the fracture mechanics theory are integrated together for evaluation of the moisture sensitivity of plastic IC packages.","PeriodicalId":339633,"journal":{"name":"1997 Proceedings 47th Electronic Components and Technology Conference","volume":"36 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"13","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1997 Proceedings 47th Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1997.606206","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 13
Abstract
Material delamination is a commonly encountered reliability problem with plastic surface mount devices. This paper describes a systematic procedure to assess plastic package delamination. In this procedure, the JEDEC reliability tests (EIA/JESD22-A112-A and A113-A), the finite element stress analysis, and the fracture mechanics theory are integrated together for evaluation of the moisture sensitivity of plastic IC packages.
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