A 60GHz Phased Array Transceiver Chipset in 45nm RF SOI Featuring Channel Aggregation Using HRM-Based Frequency Interleaving

Armagan Dascurcu, Sohail Ahasan, Ali Binaie, Kuei Jih Lu, A. Natarajan, H. Krishnaswamy
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引用次数: 2

Abstract

Channel aggregation at mm-wave enables extremely high data rates, but necessitates high-speed data converters. This paper presents an alternative approach leveraging HRM-based frequency interleaving (FI), which relaxes the requirements on the data converters, reducing their power consumption and cost. The implemented 45nm RF SOI chipset includes 4-element 60GHz phased-array RX and TX chips, and 4-channel TX and RX baseband (BB) FI channelizer chips, which channelize 8GHz of bandwidth (BW) over 59–67 G Hz into 4 channels. Measured link results indicate that the BB FI channelizers and 60GHz phased array ICs together achieve sufficient SNDR in each channel to support 16-QAM and 64-QAM modulations over wide bandwidths, enabling wireless links at 32Gbps and beyond.
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45nm射频SOI中60GHz相控阵收发器芯片组,采用基于hrm的频率交错技术实现信道聚合
毫米波的信道聚合可以实现极高的数据速率,但需要高速数据转换器。本文提出了一种利用基于hrm的频率交织(FI)的替代方法,该方法放宽了对数据转换器的要求,降低了它们的功耗和成本。实现的45nm RF SOI芯片组包括4元60GHz相控阵RX和TX芯片,以及4通道TX和RX基带(BB) FI信道化芯片,可将59 - 67g Hz以上的8GHz带宽(BW)信道化为4个通道。链路测量结果表明,BB FI信道器和60GHz相控阵集成电路在每个信道中共同实现足够的SNDR,以支持宽带上的16-QAM和64-QAM调制,从而实现32Gbps及以上的无线链路。
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