{"title":"Intermetallic reactions between lead-free SnAgCu solder and Ni(P)/Au surface finish on PWBs","authors":"K. Zeng, V. Vuorinen, J. Kivilahti","doi":"10.1109/ECTC.2001.927808","DOIUrl":null,"url":null,"abstract":"Due to its toxicity, Pb is likely to be eliminated eventually from electronic products and, therefore, it is important to understand and control the compatibility of the Sn-Ag-Cu solder alloys with Ni(P)/Au metallizations. Transmission electron microscopy and scanning electron microscopy were employed to analyze the interfacial microstructure. The intermetallic compound Cu/sub 6/Sn/sub 5/, containing a small amount of dissolved Ni, was found to form preferentially on the Ni coating. This compound layer served as a barrier for the reaction of Sn with the Ni coating. On the Ni(P) side, a nickel phosphide was identified. Thermodynamic evaluation of the Cu-Ni-Sn system was carried out to rationalize the enrichment of Cu at the solder/finish interface. Effects of the interfacial reactions on joint reliability are discussed.","PeriodicalId":340217,"journal":{"name":"2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220)","volume":"84 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-05-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"40","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2001.927808","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 40
Abstract
Due to its toxicity, Pb is likely to be eliminated eventually from electronic products and, therefore, it is important to understand and control the compatibility of the Sn-Ag-Cu solder alloys with Ni(P)/Au metallizations. Transmission electron microscopy and scanning electron microscopy were employed to analyze the interfacial microstructure. The intermetallic compound Cu/sub 6/Sn/sub 5/, containing a small amount of dissolved Ni, was found to form preferentially on the Ni coating. This compound layer served as a barrier for the reaction of Sn with the Ni coating. On the Ni(P) side, a nickel phosphide was identified. Thermodynamic evaluation of the Cu-Ni-Sn system was carried out to rationalize the enrichment of Cu at the solder/finish interface. Effects of the interfacial reactions on joint reliability are discussed.
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