Nanosilver sintered joints on elastic substrates

Abstract

In Institute of Electronic Materials Technology in Warsaw novel silver pastes were elaborated, that contains silver nanoparticles and are able to sinter at temperatures below 300°C resulting in low resistance layers (2 mQ/□). No other thick film paste is capable of achieving this resistance in such a low curing temperature. Low exposure to heat allows depositing and curing on wide variety of elastic substrates including elastic Kapton foil or paper. In present work the authors proved that this paste is suitable for low temperature joining technique (LTJT) which is an alternative to soldering and adhesive joining. The temperature 300°C was suitable to obtain joints, which can withstand over 30000 cycles in bend test.