Pub Date : 2014-09-01DOI: 10.1109/ISSE.2014.6887584
Martin Molhanec, I. Beshajova-Pelikanova
This contribution introduces Failure Mode and Effect Analysis (FMEA) method applied for screen printing process. A model based paradigm is used for executing FMEA method. The Authors employ this approach for increasing its efficiency and productivity. This work builds on the achievements resulting from the previous works concerning applying the Model Based FMEA method for technological processes and products. In this article we present a knowledge model of screen printing process as well as meta-model of process generally. Finally, the report of potential defects, causes, consequences and provisions for investigated screen printing process in the FMEA sheet form is presented.
{"title":"Employing model based failure mode and effect analysis for screen printing","authors":"Martin Molhanec, I. Beshajova-Pelikanova","doi":"10.1109/ISSE.2014.6887584","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887584","url":null,"abstract":"This contribution introduces Failure Mode and Effect Analysis (FMEA) method applied for screen printing process. A model based paradigm is used for executing FMEA method. The Authors employ this approach for increasing its efficiency and productivity. This work builds on the achievements resulting from the previous works concerning applying the Model Based FMEA method for technological processes and products. In this article we present a knowledge model of screen printing process as well as meta-model of process generally. Finally, the report of potential defects, causes, consequences and provisions for investigated screen printing process in the FMEA sheet form is presented.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129686897","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887601
P. Matkowski, T. Falat, Z. Żaluk, J. Felba, A. Moscicki
Continuous miniaturization of semiconductor devices enables integration in packages on increasingly smaller surfaces. Increasing power and minimization of dimensions results in diametrical increase of thermal flux density. Current works are focused on high performance TIMs (Thermal Interface materials). The main role of such TIMs is efficient dissipation of heat from electronic device to the surface. Within the frame of the study thermal interconnections made of sintered nano silver pastes were evaluated in terms of the application as layers that effectively remove the heat from semiconductor structures. Structure of TIM interconnections between silicon die and ENIG (Electroless Nickel Immersion Gold) on copper/FR4 substrate was the object of the study. X-Ray CT analyses have shown that voids presence, contact surface and interconnection thickness strongly depends on nano-filled paste composition and technique of application. The results will be compared with results of further studies (i.e. electrical and thermo-mechanical measurements).
{"title":"Structure of the Thermal Interface connection made of sintered nano silver","authors":"P. Matkowski, T. Falat, Z. Żaluk, J. Felba, A. Moscicki","doi":"10.1109/ISSE.2014.6887601","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887601","url":null,"abstract":"Continuous miniaturization of semiconductor devices enables integration in packages on increasingly smaller surfaces. Increasing power and minimization of dimensions results in diametrical increase of thermal flux density. Current works are focused on high performance TIMs (Thermal Interface materials). The main role of such TIMs is efficient dissipation of heat from electronic device to the surface. Within the frame of the study thermal interconnections made of sintered nano silver pastes were evaluated in terms of the application as layers that effectively remove the heat from semiconductor structures. Structure of TIM interconnections between silicon die and ENIG (Electroless Nickel Immersion Gold) on copper/FR4 substrate was the object of the study. X-Ray CT analyses have shown that voids presence, contact surface and interconnection thickness strongly depends on nano-filled paste composition and technique of application. The results will be compared with results of further studies (i.e. electrical and thermo-mechanical measurements).","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123669185","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887622
M. Franz, I. Szendiuch
The construction boom of photovoltaic (PV) plants in Europe has passed its peak. 75 % of the cumulated installed power has been built in the last three years. This work investigated share, distribution, and sizes of free-field PV plants in Europe by evaluation of manufacturer's reference data, governmental data and Google mapping. In the region of South Moravia (Czech Republic) free-field PV plants and roof-top plants in Brno were mapped and analyzed in detail. The result of this work is a snapshot of the PV solar activity in 28 member countries of the European Union (EU28) as at December 2013.
{"title":"Distribution of free-field photovoltaic plants in Europe and exemplarily in South Moravia, Czech Republic","authors":"M. Franz, I. Szendiuch","doi":"10.1109/ISSE.2014.6887622","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887622","url":null,"abstract":"The construction boom of photovoltaic (PV) plants in Europe has passed its peak. 75 % of the cumulated installed power has been built in the last three years. This work investigated share, distribution, and sizes of free-field PV plants in Europe by evaluation of manufacturer's reference data, governmental data and Google mapping. In the region of South Moravia (Czech Republic) free-field PV plants and roof-top plants in Brno were mapped and analyzed in detail. The result of this work is a snapshot of the PV solar activity in 28 member countries of the European Union (EU28) as at December 2013.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"183 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115063638","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887611
R. Lupu, R. Bozomitu, V. Cehan
Among the various techniques used for the detection of gaze direction, the procedure based on determining pupil or iris position using video camera connected to a computer deserves special attention. Gaze follows the movement of an item - “a target point” on the PC screen, the video camera captures the images of the eye and the PC determines the gaze position; this appears as “a map” on which the positions detected show as points around the target point. It is essential for the result to consist in a stable image or a map for gaze direction to be recognized by the PC. This paper presents a procedure for achieving stable cursor movement using low-pass filtering. It discusses the design, achievement and test results of a digital low-pass filter used in order to ensure the stableness of the point on the map that corresponds to gaze direction.
{"title":"Detection of gaze direction by using improved eye-tracking technique","authors":"R. Lupu, R. Bozomitu, V. Cehan","doi":"10.1109/ISSE.2014.6887611","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887611","url":null,"abstract":"Among the various techniques used for the detection of gaze direction, the procedure based on determining pupil or iris position using video camera connected to a computer deserves special attention. Gaze follows the movement of an item - “a target point” on the PC screen, the video camera captures the images of the eye and the PC determines the gaze position; this appears as “a map” on which the positions detected show as points around the target point. It is essential for the result to consist in a stable image or a map for gaze direction to be recognized by the PC. This paper presents a procedure for achieving stable cursor movement using low-pass filtering. It discusses the design, achievement and test results of a digital low-pass filter used in order to ensure the stableness of the point on the map that corresponds to gaze direction.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"85 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122717188","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887621
D. Petreus, T. Patarau, R. Etz, T. Frențiu
The current work presents a miniaturized, capacitive coupled plasma micro-torch equipment used for simultaneous multielemental analysis. The equipment is used in environment and foods control. The equipment is composed of: an RF generator supplying a resonant transformer for the plasma flame generation, a vaporizer, a microcontroller that controls the plasma generator, a computer which runs a PC interface that controls the RF generator and the vaporizer, a spectrometer for the spectral analysis, battery, inverter and an argon tank.
{"title":"Portable system for heavy metals detection based on spectral analysis","authors":"D. Petreus, T. Patarau, R. Etz, T. Frențiu","doi":"10.1109/ISSE.2014.6887621","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887621","url":null,"abstract":"The current work presents a miniaturized, capacitive coupled plasma micro-torch equipment used for simultaneous multielemental analysis. The equipment is used in environment and foods control. The equipment is composed of: an RF generator supplying a resonant transformer for the plasma flame generation, a vaporizer, a microcontroller that controls the plasma generator, a computer which runs a PC interface that controls the RF generator and the vaporizer, a spectrometer for the spectral analysis, battery, inverter and an argon tank.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128972764","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887553
A. Maric, N. Blaz, G. Radosavljevic, S. Toškov, L. Zivanov
This paper offers new results of material characterization of ferrite LTCC (Low Temperature Co-fired Ceramic) tape and deals with determination of its magnetic properties. Affects of processing parameters variation (firing profile) on properties of ferrite LTCC tape are determined for the commercially available ESL40011 tape. Obtained results provide information for complex permeability values for four different peak sintering temperatures (885°C, 1000°C, 1100°C and 1200°C) in the frequency range from 300 kHz to 1 GHz. Provided results show significant increase in permeability value with increase of the peak sintering temperature. This increase is followed with increase of losses in the ferrite material and the cut-back of the useful frequency range. In addition, these results can be correlated with results obtained by optical inspection of prepared samples.
{"title":"Affect of peak sintering temperature variation on LTCC ferrite tape complex permeability","authors":"A. Maric, N. Blaz, G. Radosavljevic, S. Toškov, L. Zivanov","doi":"10.1109/ISSE.2014.6887553","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887553","url":null,"abstract":"This paper offers new results of material characterization of ferrite LTCC (Low Temperature Co-fired Ceramic) tape and deals with determination of its magnetic properties. Affects of processing parameters variation (firing profile) on properties of ferrite LTCC tape are determined for the commercially available ESL40011 tape. Obtained results provide information for complex permeability values for four different peak sintering temperatures (885°C, 1000°C, 1100°C and 1200°C) in the frequency range from 300 kHz to 1 GHz. Provided results show significant increase in permeability value with increase of the peak sintering temperature. This increase is followed with increase of losses in the ferrite material and the cut-back of the useful frequency range. In addition, these results can be correlated with results obtained by optical inspection of prepared samples.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"134 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116344287","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887615
David Kurzmanowski, J. Wilde
Today's non-mass-production PCB-manufacturers have to be able to deliver a wide spectrum of PCB-layouts with a vast amount of different and sometimes contradicting requirements. Therefore both, the equipment and production processes have to be very flexible and well controlled. Nevertheless experience in PCB-production affirms that the outcome of some processes can be significantly influenced by the PCB-layout. Design of Experiments (DoE) is widely used for optimizing manufacturing processes and identifying influencing variables. Hence DoE should be useful for tagging crucial workpiece variables and evaluating their influence on particular manufacturing processes and machines. Using the example of copper deposition in mechanically-drilled areas of PCBs, a possible realization of DoE and its effectiveness is shown. The importance of focusing on the characteristics of the product to improve knowledge and quality of its manufacturing processes is also illustrated.
{"title":"Using layout data for predicting effects on production processes in PCB-manufacturing","authors":"David Kurzmanowski, J. Wilde","doi":"10.1109/ISSE.2014.6887615","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887615","url":null,"abstract":"Today's non-mass-production PCB-manufacturers have to be able to deliver a wide spectrum of PCB-layouts with a vast amount of different and sometimes contradicting requirements. Therefore both, the equipment and production processes have to be very flexible and well controlled. Nevertheless experience in PCB-production affirms that the outcome of some processes can be significantly influenced by the PCB-layout. Design of Experiments (DoE) is widely used for optimizing manufacturing processes and identifying influencing variables. Hence DoE should be useful for tagging crucial workpiece variables and evaluating their influence on particular manufacturing processes and machines. Using the example of copper deposition in mechanically-drilled areas of PCBs, a possible realization of DoE and its effectiveness is shown. The importance of focusing on the characteristics of the product to improve knowledge and quality of its manufacturing processes is also illustrated.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"56 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121584426","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887583
B. Illés, Barbara Horváth
In this paper the tin whisker growth properties of lead-free SAC (SnAgCu) solder alloys were investigated. There different alloys were studied: two micro-alloyed SAC (SnAgCu+Bi+Sb) and the widely applied SAC305 as reference. FR4 test board was developed for 18 pieces of 0805 chip resistor components. Solder joints were fabricated on imm-Sn surface finish. The samples were aged in elevated temperatures and different humidity levels to induce the tin whisker formation. Three kinds of aging conditions have been used: 85°C/85RH%, 105°C/100RH% and 105°C/20RH%. The test duration was 3000 hours. Whisker growth was checked after every 500 hours by scanning electron microscope. It was shown that the lead-free SAC solder alloys can also develop tin whiskers and the whiskering ability depends on the composition of the SAC solders.
{"title":"Tin whisker growth from low Ag content micro-alloyed SAC solders","authors":"B. Illés, Barbara Horváth","doi":"10.1109/ISSE.2014.6887583","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887583","url":null,"abstract":"In this paper the tin whisker growth properties of lead-free SAC (SnAgCu) solder alloys were investigated. There different alloys were studied: two micro-alloyed SAC (SnAgCu+Bi+Sb) and the widely applied SAC305 as reference. FR4 test board was developed for 18 pieces of 0805 chip resistor components. Solder joints were fabricated on imm-Sn surface finish. The samples were aged in elevated temperatures and different humidity levels to induce the tin whisker formation. Three kinds of aging conditions have been used: 85°C/85RH%, 105°C/100RH% and 105°C/20RH%. The test duration was 3000 hours. Whisker growth was checked after every 500 hours by scanning electron microscope. It was shown that the lead-free SAC solder alloys can also develop tin whiskers and the whiskering ability depends on the composition of the SAC solders.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124491024","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887575
K. Ruman, A. Pietrikova, I. Vehec, Tibor Rovensky, P. Galajda
The aim of this paper lies in a design, simulation and integration of microstrip Band-Pass (BP) and Low-Pass (LP) filters into one multilayer package based on LTCC. In this article, we introduce five-section microstrip hairpin BP filter with a centre frequency of 7 GHz and a bandwidth of approx. 2 GHz and microstrip stepped-impedance LP filter with a cut-off frequency of 2.5 GHz. The paper presents simulated and measured results of mentioned filters' scattering parameters (S parameters) based on two different LTCC substrates (GreenTape 9K7X as well as GreenTape 951PX). Accent of this article was to investigate the impact of interlayer vias on microstrip LP filters' performances in the high frequency (HF) area. This paper shows a possibility of how to integrated two different types of filters in one multilayer module without mutual interference in HF area. The developed multilayer structure with integrated microstrip filters should be used as a part of I - Q (In-phase Quadrature) demodulator presented in [1].
本文的目的是将微带带通(BP)和低通(LP)滤波器设计、仿真和集成到一个基于LTCC的多层封装中。本文介绍了一种中心频率为7ghz、带宽约为7ghz的五段微带发夹BP滤波器。2 GHz和微带阶跃阻抗LP滤波器，截止频率为2.5 GHz。本文给出了基于两种不同LTCC衬底(GreenTape 9K7X和GreenTape 951PX)的上述滤波器散射参数(S参数)的模拟和测量结果。本文的重点是研究层间通孔对微带LP滤波器高频性能的影响。本文给出了一种将两种不同类型的滤波器集成在一个多层模块中的可能性，在高频区互不干扰。所开发的带集成微带滤波器的多层结构应作为[1]中提出的I - Q (in -phase Quadrature)解调器的一部分。
{"title":"Integration of microstrip LP and BP filters to multilayer structure based on various LTCC","authors":"K. Ruman, A. Pietrikova, I. Vehec, Tibor Rovensky, P. Galajda","doi":"10.1109/ISSE.2014.6887575","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887575","url":null,"abstract":"The aim of this paper lies in a design, simulation and integration of microstrip Band-Pass (BP) and Low-Pass (LP) filters into one multilayer package based on LTCC. In this article, we introduce five-section microstrip hairpin BP filter with a centre frequency of 7 GHz and a bandwidth of approx. 2 GHz and microstrip stepped-impedance LP filter with a cut-off frequency of 2.5 GHz. The paper presents simulated and measured results of mentioned filters' scattering parameters (S parameters) based on two different LTCC substrates (GreenTape 9K7X as well as GreenTape 951PX). Accent of this article was to investigate the impact of interlayer vias on microstrip LP filters' performances in the high frequency (HF) area. This paper shows a possibility of how to integrated two different types of filters in one multilayer module without mutual interference in HF area. The developed multilayer structure with integrated microstrip filters should be used as a part of I - Q (In-phase Quadrature) demodulator presented in [1].","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127674665","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-05-07DOI: 10.1109/ISSE.2014.6887632
A. Dąbrowski, L. Golonka
In the paper technology and properties of a differential pressure sensor utilizing ultrasonic waves are presented. The device consists of a LTCC (Low Temperature Co-fired Ceramics) membrane with PZT (Lead Zirconate Titanate) active layer with two interdigitated transducers (IDTs). The sensor is a completely ceramic structure equipped with two gas inlets, hence measurements of differential pressure up to 20 kPa is possible. The properties of the sensor are determined in resonator mode, where frequency shift is observed during pressure and temperature changes. The sensor exhibits sensitivity of about -400 Hz/kPa and a thermal drift of about -2000 Hz/°C. Electronic circuits: amplifier and frequency counter are described. The thermal drift is compensated using an integrated thick-film PTC (positive temperature coefficient) resistor and software correction.
{"title":"LTCC/PZT differential pressure sensor utilizing ultrasonic wave resonator","authors":"A. Dąbrowski, L. Golonka","doi":"10.1109/ISSE.2014.6887632","DOIUrl":"https://doi.org/10.1109/ISSE.2014.6887632","url":null,"abstract":"In the paper technology and properties of a differential pressure sensor utilizing ultrasonic waves are presented. The device consists of a LTCC (Low Temperature Co-fired Ceramics) membrane with PZT (Lead Zirconate Titanate) active layer with two interdigitated transducers (IDTs). The sensor is a completely ceramic structure equipped with two gas inlets, hence measurements of differential pressure up to 20 kPa is possible. The properties of the sensor are determined in resonator mode, where frequency shift is observed during pressure and temperature changes. The sensor exhibits sensitivity of about -400 Hz/kPa and a thermal drift of about -2000 Hz/°C. Electronic circuits: amplifier and frequency counter are described. The thermal drift is compensated using an integrated thick-film PTC (positive temperature coefficient) resistor and software correction.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125744717","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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