Calibrate piezoresistive stress sensors through the assembled structure

Abstract

In this work, a simple assembled structure was designed and fabricated so that the calibration procedures on piezoresisitve stress sensors for microelectronic packaging can be simpler, more accurate, and more efficient. After comparing with the previous work results, validity of the aforementioned new structure was next demonstrated through experimental data. Since many accessory experimental facilities employed in traditional calibration procedure become unnecessary, the new methodology takes great advantage on piezoresisitve coefficient calibrations, especially for calibration at temperature other than room temperature.