First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)最新文献
Pub Date : 2001-10-21DOI: 10.1109/POLYTR.2001.973265
H. Schaefer, T. Gesang, A. Hartwig, H. Knaebel, U. Maurieschat, T. Riesenbeck
The scientific field of "Adaptronics" combines sensor and actuator effects with electronics. The components furnished with adaptronics shall sense relevant properties and shall adapt in an intelligent way-they shall "feel, think and act". For instance, one application is the active vibration compensation of dynamically stressed structures. The scope of the work to be presented is to manufacture sensor/actuator microsystems with a low stiffness and thickness in order to sustain the favourable properties of the lightweight material used. In so doing, various adhesives and casting materials play an indispensable part in the manufacturing processes. The micro manufacturing of such systems is an activity of the Fraunhofer-Institute IFAM. The approach chosen includes the utilisation of piezo electric fibres in the diameter range from 20 /spl mu/m-200 /spl mu/m. The fibre modules consist of many fibres being contacted by interdigitated electrodes made of electrically conductive adhesives. In addition, structural adhesives and casting polymers are used.
{"title":"Polymeric materials for adaptronic fibre modules","authors":"H. Schaefer, T. Gesang, A. Hartwig, H. Knaebel, U. Maurieschat, T. Riesenbeck","doi":"10.1109/POLYTR.2001.973265","DOIUrl":"https://doi.org/10.1109/POLYTR.2001.973265","url":null,"abstract":"The scientific field of \"Adaptronics\" combines sensor and actuator effects with electronics. The components furnished with adaptronics shall sense relevant properties and shall adapt in an intelligent way-they shall \"feel, think and act\". For instance, one application is the active vibration compensation of dynamically stressed structures. The scope of the work to be presented is to manufacture sensor/actuator microsystems with a low stiffness and thickness in order to sustain the favourable properties of the lightweight material used. In so doing, various adhesives and casting materials play an indispensable part in the manufacturing processes. The micro manufacturing of such systems is an activity of the Fraunhofer-Institute IFAM. The approach chosen includes the utilisation of piezo electric fibres in the diameter range from 20 /spl mu/m-200 /spl mu/m. The fibre modules consist of many fibres being contacted by interdigitated electrodes made of electrically conductive adhesives. In addition, structural adhesives and casting polymers are used.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114501319","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-10-21DOI: 10.1109/POLYTR.2001.973282
J. Liu
A theoretical model for lifetime prediction of anisotropic conductive adhesive joints during temperature cycling is developed. The model is simple and elegant in the way that it only needs data from two resistance measurements and yet is able to predict the total cyclic life to failure. One of the resistance values chosen is at zero cycles, before the testing, and the other one can be chosen at any given number of temperature cycles. This implies that one can perform a limited number of test cycles and can therefore save a lot of testing time. The model is based on the hypothesis that the anisotropic conductive joint can be treated as a pressure sensitive Holm contact and that the conductivity of the contact is a function of the pressure on the contact point. Finally, the model is based on the fact that a crack is formed during the cycling. The resistance of the joint increases as a function of the increasing crack length and the crack length in turn is a function of the number of cycles.
{"title":"Life time prediction of anisotropic conductive adhesive joints during temperature cycling for electronics interconnect","authors":"J. Liu","doi":"10.1109/POLYTR.2001.973282","DOIUrl":"https://doi.org/10.1109/POLYTR.2001.973282","url":null,"abstract":"A theoretical model for lifetime prediction of anisotropic conductive adhesive joints during temperature cycling is developed. The model is simple and elegant in the way that it only needs data from two resistance measurements and yet is able to predict the total cyclic life to failure. One of the resistance values chosen is at zero cycles, before the testing, and the other one can be chosen at any given number of temperature cycles. This implies that one can perform a limited number of test cycles and can therefore save a lot of testing time. The model is based on the hypothesis that the anisotropic conductive joint can be treated as a pressure sensitive Holm contact and that the conductivity of the contact is a function of the pressure on the contact point. Finally, the model is based on the fact that a crack is formed during the cycling. The resistance of the joint increases as a function of the increasing crack length and the crack length in turn is a function of the number of cycles.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128741126","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-10-21DOI: 10.1109/POLYTR.2001.973291
O. Figovsky, L. Shapovalov
Polyurethane adhesives and coatings are widely used in Microelectronics and Photonics. The novel matrix of advanced nonisocyanate polyurethane (NIPU) coatings and adhesives are formed from two oligomers, one of them contains terminated cyclocarbonate groups (CC-oligomer), second terminated primary amines groups. As a result of forming an intramolecular bond and blockage of carbonyl oxygen it is considerably lowers the susceptibility of the whole urethane group to hydrolysis. We have elaborated a few technologies for the synthesis of CC-oligomers with different structures that give us possibility for preparing coatings from high elastic to very hard. By the data of IR-spectroscopy investigation the process of curing different CC-oligomers and primary amine oligomers was studied and give us all the needed information for many coating compositions' preparing according a lot of requests for a wide spectrum of industrial, decorative and another types of coatings. The chemical resistance and permeability of hybrid nonisocyanate polyurethane (HNIPU) coatings is 1.5-2.5 times better in comparison with conventional polyurethane coatings of the similar structure without the intermolecular hydrogen bond. Corrosive passive adhesives were prepared by a new method of their synthesis the method of multiplication. In the report will present the data of their testing by ASTM, DIN and BS. At the end of 2001 the industrial production of different nonisocyanate polyurethane systems for coating, adhesives and sealant will be established in the USA.
{"title":"Nonisocyanate polyurethanes for adhesives and coatings","authors":"O. Figovsky, L. Shapovalov","doi":"10.1109/POLYTR.2001.973291","DOIUrl":"https://doi.org/10.1109/POLYTR.2001.973291","url":null,"abstract":"Polyurethane adhesives and coatings are widely used in Microelectronics and Photonics. The novel matrix of advanced nonisocyanate polyurethane (NIPU) coatings and adhesives are formed from two oligomers, one of them contains terminated cyclocarbonate groups (CC-oligomer), second terminated primary amines groups. As a result of forming an intramolecular bond and blockage of carbonyl oxygen it is considerably lowers the susceptibility of the whole urethane group to hydrolysis. We have elaborated a few technologies for the synthesis of CC-oligomers with different structures that give us possibility for preparing coatings from high elastic to very hard. By the data of IR-spectroscopy investigation the process of curing different CC-oligomers and primary amine oligomers was studied and give us all the needed information for many coating compositions' preparing according a lot of requests for a wide spectrum of industrial, decorative and another types of coatings. The chemical resistance and permeability of hybrid nonisocyanate polyurethane (HNIPU) coatings is 1.5-2.5 times better in comparison with conventional polyurethane coatings of the similar structure without the intermolecular hydrogen bond. Corrosive passive adhesives were prepared by a new method of their synthesis the method of multiplication. In the report will present the data of their testing by ASTM, DIN and BS. At the end of 2001 the industrial production of different nonisocyanate polyurethane systems for coating, adhesives and sealant will be established in the USA.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116416510","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-10-21DOI: 10.1109/POLYTR.2001.973270
K. Becker, T. Braun, M. Koch, F. Ansorge, R. Aschenbrenner, H. Reichl
The process development for four flip chip molding compounds was based on material characterization by DSC, DMA and TMA. It was shown that the materials tested do allow reliable flip chip molding. Materials properties concerning processability and reliability are promising. There is strong potential of the technology for the increasing market of flip chip packages as certain types of BGA's and, with further miniaturization, CSP's. As these packages incorporate typically single dies, the transfer mold process can be adapted without major changes to existing equipment. Even for future developments such as one chip flip chip SIP's using advanced IC thinning and assembly methods, the flip chip molding underfill process is a successful vision for reliable encapsulation.
{"title":"Advanced flip chip encapsulation: transfer molding process for simultaneous underfilling and postencapsulation","authors":"K. Becker, T. Braun, M. Koch, F. Ansorge, R. Aschenbrenner, H. Reichl","doi":"10.1109/POLYTR.2001.973270","DOIUrl":"https://doi.org/10.1109/POLYTR.2001.973270","url":null,"abstract":"The process development for four flip chip molding compounds was based on material characterization by DSC, DMA and TMA. It was shown that the materials tested do allow reliable flip chip molding. Materials properties concerning processability and reliability are promising. There is strong potential of the technology for the increasing market of flip chip packages as certain types of BGA's and, with further miniaturization, CSP's. As these packages incorporate typically single dies, the transfer mold process can be adapted without major changes to existing equipment. Even for future developments such as one chip flip chip SIP's using advanced IC thinning and assembly methods, the flip chip molding underfill process is a successful vision for reliable encapsulation.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126948806","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-10-21DOI: 10.1109/POLYTR.2001.973248
H. Hofstraat
Polymer electronics forms a new and very promising technological area, which may pave the way to many new applications and products. The use of electroluminescent semiconductive polymers for emissive displays is already rather mature. At present, the first commercial products are ready to be launched. Polymer light-emitting diode based displays indeed will be the first polymer electronics products to reach the market. It is expected that the thin emissive displays, which can be realized with this new technology, will command an important place in the display market. The use of polymer transistors in ICs and in transponders, and as pixel switches for displays is still in its infancy. Applications have been demonstrated in a research environment, but significant effort is still required to address production issues and to demonstrate business opportunities. The current state of affairs is comparable with that at the beginning of the rise of the silicon-based IC industry, some 40 years ago. The application of polymers for low-cost electronic products, like labels and barcodes and for electronic paper, will lead to a family of very interesting new products, which will definitely change the electronics industry. New options for polymer electronics, e.g. their possible application for photovoltaics (e.g., in organic solar cells) and as sensors, and for solid storage, are just beginning to be explored. The answer to the question proposed in the title must therefore be yes.
{"title":"Will polymer electronics change the electronics industry?","authors":"H. Hofstraat","doi":"10.1109/POLYTR.2001.973248","DOIUrl":"https://doi.org/10.1109/POLYTR.2001.973248","url":null,"abstract":"Polymer electronics forms a new and very promising technological area, which may pave the way to many new applications and products. The use of electroluminescent semiconductive polymers for emissive displays is already rather mature. At present, the first commercial products are ready to be launched. Polymer light-emitting diode based displays indeed will be the first polymer electronics products to reach the market. It is expected that the thin emissive displays, which can be realized with this new technology, will command an important place in the display market. The use of polymer transistors in ICs and in transponders, and as pixel switches for displays is still in its infancy. Applications have been demonstrated in a research environment, but significant effort is still required to address production issues and to demonstrate business opportunities. The current state of affairs is comparable with that at the beginning of the rise of the silicon-based IC industry, some 40 years ago. The application of polymers for low-cost electronic products, like labels and barcodes and for electronic paper, will lead to a family of very interesting new products, which will definitely change the electronics industry. New options for polymer electronics, e.g. their possible application for photovoltaics (e.g., in organic solar cells) and as sensors, and for solid storage, are just beginning to be explored. The answer to the question proposed in the title must therefore be yes.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"04 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129228314","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-10-21DOI: 10.1109/POLYTR.2001.973254
A. Wedel, S. Janietz
Polymer materials are well known in modern microelectronics. In the past, however, they have been used mainly for passive materials, substrate and encapsulating materials and adhesives. Special polymers with conjugated units have been employed as functional materials for the last decade. The first displays based on organic light-emitting diodes (OLEDs) have been on the market for a short time and the development of flexible OLEDs with a long lifetime is the proclaimed aim of many research institutes and companies. The Fraunhofer IAP is working on the development of new polymer materials and device technologies in this research area.
{"title":"Polymer materials for display technology","authors":"A. Wedel, S. Janietz","doi":"10.1109/POLYTR.2001.973254","DOIUrl":"https://doi.org/10.1109/POLYTR.2001.973254","url":null,"abstract":"Polymer materials are well known in modern microelectronics. In the past, however, they have been used mainly for passive materials, substrate and encapsulating materials and adhesives. Special polymers with conjugated units have been employed as functional materials for the last decade. The first displays based on organic light-emitting diodes (OLEDs) have been on the market for a short time and the development of flexible OLEDs with a long lifetime is the proclaimed aim of many research institutes and companies. The Fraunhofer IAP is working on the development of new polymer materials and device technologies in this research area.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126893400","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-10-21DOI: 10.1109/POLYTR.2001.973249
G. Murakami
In semiconductor packaging technology for mobile phones, rapid development in materials, structures, manufacturing methods, and design architecture are making it possible to create phones with higher density, lighter weight, and better performance than ever before. Innovations in polymer materials are largely responsible for such improvements. Future-generation mobile phones are required to keep up with wireless communications on higher-speed transmission. Due to this requirement, the mobile phone industry expects engineers to develop new polymer materials capable of keeping circuitry free from electrical noise even under high-speed operation.
{"title":"Semiconductor packaging technology for mobile phones in Japan","authors":"G. Murakami","doi":"10.1109/POLYTR.2001.973249","DOIUrl":"https://doi.org/10.1109/POLYTR.2001.973249","url":null,"abstract":"In semiconductor packaging technology for mobile phones, rapid development in materials, structures, manufacturing methods, and design architecture are making it possible to create phones with higher density, lighter weight, and better performance than ever before. Innovations in polymer materials are largely responsible for such improvements. Future-generation mobile phones are required to keep up with wireless communications on higher-speed transmission. Due to this requirement, the mobile phone industry expects engineers to develop new polymer materials capable of keeping circuitry free from electrical noise even under high-speed operation.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115948608","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-10-21DOI: 10.1109/POLYTR.2001.973271
R. Dudek, H. Walter, B. Michel, P. Alpern, R. Schmidt, R. Tilgner
Theoretical analysis of the popcorn phenomenon requires the thermo-mechanical and moisture diffusion properties of the polymers in the packages under investigation. Some of these properties, including fracture toughness, are given for the four commercially available epoxy molding compounds (EMCs) used. Fracture toughness measurements with precracked beams as well as analyses based on a simple method to estimate the toughness from bending experiments are used. For the latter investigations, the basic assumption is that the filler particles act as initial flaws. The problem is analytically treated as a beam with a surface crack, and an estimate of the critical fracture toughness can be calculated by a simple formula. By means of 3D-FE analyses the moisture diffusion into a thin quad flat pack (TQFP) package is studied for various standard moisture preconditioning levels. It is shown that the different popcorn failure types correspond to different moisture distributions within the die attach layer depending on the different preconditioning levels.
{"title":"Studies on parameters for popcorn cracking","authors":"R. Dudek, H. Walter, B. Michel, P. Alpern, R. Schmidt, R. Tilgner","doi":"10.1109/POLYTR.2001.973271","DOIUrl":"https://doi.org/10.1109/POLYTR.2001.973271","url":null,"abstract":"Theoretical analysis of the popcorn phenomenon requires the thermo-mechanical and moisture diffusion properties of the polymers in the packages under investigation. Some of these properties, including fracture toughness, are given for the four commercially available epoxy molding compounds (EMCs) used. Fracture toughness measurements with precracked beams as well as analyses based on a simple method to estimate the toughness from bending experiments are used. For the latter investigations, the basic assumption is that the filler particles act as initial flaws. The problem is analytically treated as a beam with a surface crack, and an estimate of the critical fracture toughness can be calculated by a simple formula. By means of 3D-FE analyses the moisture diffusion into a thin quad flat pack (TQFP) package is studied for various standard moisture preconditioning levels. It is shown that the different popcorn failure types correspond to different moisture distributions within the die attach layer depending on the different preconditioning levels.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121819653","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-10-21DOI: 10.1109/POLYTR.2001.973263
M. Schrodner, S. Sensfuss, H. Roth, R.-I. Stohn, W. Clemens, A. Bernds, W. Fix
Plastic electronics are set to be one of the next applications of semiconducting polymers appearing on the market. The electronics are constructed from integrated plastic circuits (IPC) based on organic field effect transistors (OFETs). The aim of this technology is to create low cost electronics using inexpensive standard polymer technologies in combination with laser and/or printing technologies which allow mass production for low cost mass products like ident tags, electronic watermarks, smart cards, electronic labels. Although many improvements have been achieved during the last few years, numerous problems still must be solved. The authors present recent results for OFETs with conjugated polymers like polythiophenes as active semiconducting material. The performance of the OFETs strongly depends on the quality of the semiconducting layer, i.e. molecular ordering, homogeneity, purity and doping level. Several aspects of preparing OFETs with special emphasis on the effect of the properties of the semiconducting polymer on the transistor parameters are discussed.
{"title":"Plastic electronics based on semiconducting polymers","authors":"M. Schrodner, S. Sensfuss, H. Roth, R.-I. Stohn, W. Clemens, A. Bernds, W. Fix","doi":"10.1109/POLYTR.2001.973263","DOIUrl":"https://doi.org/10.1109/POLYTR.2001.973263","url":null,"abstract":"Plastic electronics are set to be one of the next applications of semiconducting polymers appearing on the market. The electronics are constructed from integrated plastic circuits (IPC) based on organic field effect transistors (OFETs). The aim of this technology is to create low cost electronics using inexpensive standard polymer technologies in combination with laser and/or printing technologies which allow mass production for low cost mass products like ident tags, electronic watermarks, smart cards, electronic labels. Although many improvements have been achieved during the last few years, numerous problems still must be solved. The authors present recent results for OFETs with conjugated polymers like polythiophenes as active semiconducting material. The performance of the OFETs strongly depends on the quality of the semiconducting layer, i.e. molecular ordering, homogeneity, purity and doping level. Several aspects of preparing OFETs with special emphasis on the effect of the properties of the semiconducting polymer on the transistor parameters are discussed.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"51 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122520428","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-10-21DOI: 10.1109/POLYTR.2001.973255
T. Nann
The following paper describes the new possibilities for applications, resulting from the combination of luminescent semiconductor nanoparticles (so-called quantum dots) and conducting polymers. First the theory will be briefly introduced, then three examples will be described and discussed: quantum dot light-emitting diodes (QDLEDs), generally quantum dot/conducting polymer composites and, finally, quantum dot photoelectric devices. By these examples, the state of the art is described and future possibilities are shown.
{"title":"Semiconductor nanoparticles: new building blocks for polymer-microelectronics?","authors":"T. Nann","doi":"10.1109/POLYTR.2001.973255","DOIUrl":"https://doi.org/10.1109/POLYTR.2001.973255","url":null,"abstract":"The following paper describes the new possibilities for applications, resulting from the combination of luminescent semiconductor nanoparticles (so-called quantum dots) and conducting polymers. First the theory will be briefly introduced, then three examples will be described and discussed: quantum dot light-emitting diodes (QDLEDs), generally quantum dot/conducting polymer composites and, finally, quantum dot photoelectric devices. By these examples, the state of the art is described and future possibilities are shown.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129854665","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)
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