L. Brusberg, Jason R. Grenier, Jürgen Matthies, Allen M. Miller, Chad C. Terwilliger, Jeffrey S. Clark, Beibei Zeng, Pierre Beneke
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引用次数: 5
Abstract
Co-packaged optics require novel packaging concepts for high fiber counts and low-cost assembly. We design and fabricate a glass waveguide substrate with MPO interfaces that yield an average connector loss of 0.5 dB. Simulations are performed to assess the required spring force for physical contact.
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