Simulation analysis of impurity profile extraction by SCM

K. Matsuzawa, Y. Oowaki, M. Nakamura, N. Aoki, I. Mizushima
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Abstract

We investigate the propriety of SCM (scanning capacitance microscopy) for determination of impurity distribution of MOSFETs. Two-dimensional impurity distribution is converted from /spl Delta/C//spl Delta/V signal obtained by SCM. It is revealed that the SCM signal is quite sensitive to the effects of charge depletion around the pn junction, singularity of structure in vicinity of SiO/sub 2//Si interface (edge effect), and the work function of the gate electrode. Making use of process/device simulations to analyze these effects, it is found that the SCM signal near the channel surface region of the Si substrate contains large error due to the edge effects. The lateral extent of the source/drain region obtained by SCM shows reasonable agreement with that determined by measurements and simulations of electrical characteristics of the MOSFET.
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用单片机进行杂质剖面提取的仿真分析
我们研究了SCM(扫描电容显微镜)用于测定mosfet杂质分布的合理性。二维杂质分布由单片机得到的/spl Delta/C//spl Delta/V信号转换而成。结果表明,单片机信号对pn结附近电荷耗尽、SiO/sub /Si界面附近结构奇异性(边缘效应)和栅电极功函数的影响非常敏感。利用工艺/器件模拟分析这些影响,发现由于边缘效应,硅衬底通道表面附近的单片机信号包含较大的误差。单片机得到的源极/漏极区域的横向范围与MOSFET电特性的测量和模拟结果一致。
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