Stress screening of electronic modules: investigation of effects of temperature rate of change

J. Kallis, W.K. Hammond, E.B. Curry
{"title":"Stress screening of electronic modules: investigation of effects of temperature rate of change","authors":"J. Kallis, W.K. Hammond, E.B. Curry","doi":"10.1109/ARMS.1990.67931","DOIUrl":null,"url":null,"abstract":"The authors discuss a study conducted to investigate the effects of temperature rate of change on the environmental stress screening of printed wiring assemblies (PWAs). The related effects of chamber air velocity and temperature dwell time on module temperature response were evaluated. The effects of varying thermal cycling parameter levels were investigated. The effects of various chamber air temperature rates of change and velocity levels on the temperature responses of two vastly different PWAs were measured. A thermal-cycling analysis of a PWA of the same construction as one of the two PWAs tested in the investigation was also performed. The results of a portion of the test are compared with the analytical predictions, validating the thermal response trends predicted by the mathematical model.<<ETX>>","PeriodicalId":383597,"journal":{"name":"Annual Proceedings on Reliability and Maintainability Symposium","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1990-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Annual Proceedings on Reliability and Maintainability Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ARMS.1990.67931","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 8

Abstract

The authors discuss a study conducted to investigate the effects of temperature rate of change on the environmental stress screening of printed wiring assemblies (PWAs). The related effects of chamber air velocity and temperature dwell time on module temperature response were evaluated. The effects of varying thermal cycling parameter levels were investigated. The effects of various chamber air temperature rates of change and velocity levels on the temperature responses of two vastly different PWAs were measured. A thermal-cycling analysis of a PWA of the same construction as one of the two PWAs tested in the investigation was also performed. The results of a portion of the test are compared with the analytical predictions, validating the thermal response trends predicted by the mathematical model.<>
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电子元件的应力筛选:温度变化率影响的研究
作者讨论了一项研究,以调查温度变化率对印刷布线组件(pwa)的环境应力筛选的影响。评估了室风速度和温度停留时间对模块温度响应的相关影响。研究了不同热循环参数水平的影响。测量了不同的室内空气温度变化率和速度水平对两种截然不同的PWAs温度响应的影响。对与调查中测试的两个PWA之一具有相同结构的PWA进行了热循环分析。将部分试验结果与分析预测结果进行了比较,验证了数学模型预测的热响应趋势。
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A graphical language for reliability model generation Stress screening of electronic modules: investigation of effects of temperature rate of change The endurance of EEPROMs/utilizing fault tolerant memory cells Adapting mechanical models to fit electronics Vibration and shock testing for computers
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