Microelectronics packaging curriculum development at San Jose State University

G. Selvaduray, F. Baret
{"title":"Microelectronics packaging curriculum development at San Jose State University","authors":"G. Selvaduray, F. Baret","doi":"10.1109/ECTC.1997.606166","DOIUrl":null,"url":null,"abstract":"This paper describes the development of an engineering education curriculum in microelectronic packaging at both the undergraduate and graduate levels, at the College of Engineering, San Jose State University. Motivation for establishing courses to support such a curriculum and the needs of the local electronics industry are discussed. The undergraduate courses are taught in the lecture/laboratory mode, thus requiring students to conduct experiments. The interdisciplinary graduate curriculum is offered as an area of specialization within the Master of Science in Engineering program. Guest speakers from industry are invited to discuss advances and challenges present in this constantly evolving field. The College also offers short courses for engineers practicing in industry. With NSF funding, workshops for skills enhancement of university faculty are currently in the planning stage; four such workshops will be offered during 1997-1998.","PeriodicalId":339633,"journal":{"name":"1997 Proceedings 47th Electronic Components and Technology Conference","volume":"7 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1997 Proceedings 47th Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1997.606166","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5

Abstract

This paper describes the development of an engineering education curriculum in microelectronic packaging at both the undergraduate and graduate levels, at the College of Engineering, San Jose State University. Motivation for establishing courses to support such a curriculum and the needs of the local electronics industry are discussed. The undergraduate courses are taught in the lecture/laboratory mode, thus requiring students to conduct experiments. The interdisciplinary graduate curriculum is offered as an area of specialization within the Master of Science in Engineering program. Guest speakers from industry are invited to discuss advances and challenges present in this constantly evolving field. The College also offers short courses for engineers practicing in industry. With NSF funding, workshops for skills enhancement of university faculty are currently in the planning stage; four such workshops will be offered during 1997-1998.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
圣何塞州立大学微电子封装课程开发
本文描述了圣何塞州立大学工程学院在本科和研究生阶段的微电子封装工程教育课程的发展。讨论了开设课程的动机,以支持这样的课程和本地电子工业的需要。本科课程采用讲座/实验的教学模式,要求学生进行实验。跨学科的研究生课程是作为工程硕士课程的一个专业领域提供的。邀请来自业界的演讲嘉宾讨论这个不断发展的领域的进步和挑战。学院还为在工业中实习的工程师提供短期课程。在国家科学基金的资助下,提高大学教师技能的讲习班目前正处于规划阶段;1997-1998年期间将举办四次这样的讲习班。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
High density optical interconnects for board and backplane applications using VCSELs and polymer waveguides Evaluation of plastic package delamination via reliability testing and fracture mechanics approach Mid-frequency simultaneous switching noise in computer systems Distance learning paradigms in electronics packaging: a national course on thermal design of electronic products Mechanical and electrical characterization of a dendrite connector
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1