{"title":"Novel approach to compact modeling for nonlinear thermal conduction problems","authors":"L. Codecasa","doi":"10.1109/THERMINIC.2013.6675220","DOIUrl":null,"url":null,"abstract":"In this paper a novel approach is proposed for generating dynamic compact models of nonlinear heat diffusion problems for electronics components. The method is very efficient and leads to accurate approximations of the space-time distribution of temperature rise within the component for all waveforms of the injected powers.","PeriodicalId":369128,"journal":{"name":"19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-12-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"18","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/THERMINIC.2013.6675220","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 18
Abstract
In this paper a novel approach is proposed for generating dynamic compact models of nonlinear heat diffusion problems for electronics components. The method is very efficient and leads to accurate approximations of the space-time distribution of temperature rise within the component for all waveforms of the injected powers.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
