Thermal design of a high current circuit board for automotive applications

19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2013-12-02 DOI:10.1109/THERMINIC.2013.6675245

R. Mrossko, C. Neeb, T. Hofmann, A. Neumann, J. Keller

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引用次数: 5

Abstract

The demand of cost reduction and limited installation space for automotive applications requires new and innovative approaches. One approach is to substitute DCB substrates with high current circuit boards. These circuit boards with fully embedded actives like IGBTs and Diodes allows to avoid the use of bonding wires at all and benefit from the less expensive standard circuit board technologies. Moreover it should be possible to use double sided cooling for such devices. In this paper we investigate the influence of several geometry and material parameter, like layer thicknesses, thermal conductivity and cooling power on the thermal performance of a fully embedded 650V class half bridge test board. As input for the simulations the thermal conductivity of prepreg materials were measured. It could be shown that layer thicknesses have a significant impact of the necessary cooling power. The embedding of chips directly into laminated substrates seems reliable regarding thermal loading. Further results will be obtained by thermal measurements.

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汽车用大电流电路板的热设计

降低成本的需求和有限的安装空间为汽车应用需要新的和创新的方法。一种方法是用大电流电路板代替DCB基板。这些电路板具有完全嵌入式的有源器件，如igbt和二极管，可以完全避免使用键合线，并受益于较便宜的标准电路板技术。此外，这种装置应该可以使用双面冷却。在本文中，我们研究了几个几何和材料参数，如层厚度，导热系数和冷却功率对全嵌入式650V级半桥测试板热性能的影响。作为模拟的输入，测量了预浸材料的导热系数。可以看出，层厚对所需冷却功率有显著影响。将芯片直接嵌入层压基板中对于热载荷似乎是可靠的。进一步的结果将通过热测量得到。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

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