Fabrication of ultrathin Ge template for growth of multijunction solar cells based on wafer-scale porous Ge

Tadeáš Hanuš, J. Arias‐Zapata, B. Ilahi, P. Provost, Alexandre Chapotot, A. Boucherif
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Abstract

Multijunction solar cells (MJSC) currently hold the highest efficiency on the market. However, their widespread in terrestrial applications is getting held back by the high devices cost. A considerable part of the cost mainly comes from the substrate materials such as Ge and GaAs making them nonviable for terrestrial application compared to much cheaper silicon-based solar cells. Consequently, the Ge based MJSC deployment is restrained to niche domains such as spatial applications. Accordingly, the development of nanostructured substrates allowing MJSC detachment and wafer reuse stands out as a promising approach to overcoming these limitations. In this work, we demonstrate the formation of homogenous edge-to-edge porous Ge (PGe) layers on an industry-standard 100 mm wafer-scale produced by bipolar electrochemical etching. The produced nanostructured substrates' properties are easily assessable by production line compatible, fast, and nondestructive techniques such as ellipsometry. The PGe layers have been found to exhibit excellent uniformity over the wafer' surface with a relative variation of 1% in porosity and 2% in thickness. Furthermore, we show that the PGe structural properties can be finely tuned to create on-demand characteristics including the suitability for epitaxial growth. Accordingly, low-temperature growth of ultrathin crystalline Ge layer on top of PGe structure is demonstrated. The fabricated structure has been shown to be compatible with III-V heterostructures growth drawing the way for wafer-scale detachable MJSC and substrate reuse.
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基于晶圆级多孔锗的多结太阳能电池超薄锗模板的制备
多结太阳能电池(MJSC)是目前市场上效率最高的电池。然而,它们在地面上的广泛应用受到高设备成本的阻碍。相当一部分的成本主要来自衬底材料,如锗和砷化镓,与便宜得多的硅基太阳能电池相比,它们不适合地面应用。因此,基于Ge的MJSC部署仅限于空间应用等特定领域。因此,允许MJSC分离和晶圆重复使用的纳米结构衬底的发展是克服这些限制的有前途的方法。在这项工作中,我们展示了通过双极电化学蚀刻在工业标准的100毫米晶圆尺度上形成均匀的边缘到边缘多孔锗(PGe)层。生产的纳米结构衬底的性能很容易通过生产线兼容,快速和非破坏性的技术,如椭偏测量来评估。发现PGe层在晶圆表面表现出极好的均匀性,孔隙率和厚度的相对变化为1%和2%。此外,我们表明,PGe的结构特性可以被微调,以创建按需特性,包括外延生长的适用性。在低温下,在PGe结构上生长出超薄的Ge晶层。制备的结构已被证明与III-V异质结构生长相兼容,为晶圆级可拆卸MJSC和衬底再利用开辟了道路。
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