{"title":"Interfacial Adhesion Strength of Group IV-VI Thin Film Deposited on Silicon Nitride","authors":"Xintong Zhu, R. R. Nistala, Zhi Qiang Mo","doi":"10.1109/IPFA55383.2022.9915745","DOIUrl":null,"url":null,"abstract":"The interfacial adhesion strength of group IV-VI thin film (SiCr) deposited on silicon nitride (SiN) is studied. 4-Point-Bending (4PB) technique is employed to discover the interface of weakest adhesion. Multiple methods of interface engineering are experimented to improve interfacial integrity of the thin films stack. 4PB results indicate strong correlation between process condition and critical load Gc, an indicator of interfacial adhesion strength. To validate the interface of de-lamination, elemental analysis by Auger Electron Spectroscopy (AES) is performed.","PeriodicalId":378702,"journal":{"name":"2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-07-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA55383.2022.9915745","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
The interfacial adhesion strength of group IV-VI thin film (SiCr) deposited on silicon nitride (SiN) is studied. 4-Point-Bending (4PB) technique is employed to discover the interface of weakest adhesion. Multiple methods of interface engineering are experimented to improve interfacial integrity of the thin films stack. 4PB results indicate strong correlation between process condition and critical load Gc, an indicator of interfacial adhesion strength. To validate the interface of de-lamination, elemental analysis by Auger Electron Spectroscopy (AES) is performed.
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