A Life Test Method for Rapidly Obtaining the Degradation Trend of Sensitive Parameters

Qunyong Wang, Hua Bai, Dongmei Chen, Xupeng Sun
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Abstract

In this paper, a theory and method for rapidly obtaining the degradation trend life test of sensitive parameters is introduced, which is suitable for the rapid test and evaluation of the life of electronic components. The theory of life data analysis comes from the exploratory data method (EDA),. The technical realization of rapidly obtaining the degradation trend of sensitive parameters depends on reducing the interference of test stress fluctuation to the measurement under the condition ofhigh stability test stress, and at the same time, the degradation sensitive parameters of the tested products are measured with high precision. The measured data are collected at high speed, and the degradation model of sensitive parameters with time is established on-line, and the extrapolation life of the sample is calculated according to the degradation model. For integrated circuit products, we have developed the corresponding test verification system, carried out the SRAM standby life and FPGA working life of limited samples, and explored the possibility of rapidly obtaining the degradation trend of sensitive parameters in the test method. It lays a foundation for further practical research in the future.
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快速获取敏感参数退化趋势的寿命试验方法
本文介绍了一种快速获取敏感参数退化趋势寿命试验结果的理论和方法,适用于电子元件寿命的快速测试与评价。生命数据分析理论来源于探索性数据方法(EDA)。快速获取敏感参数降解趋势的技术实现取决于在高稳定试验应力条件下,减少试验应力波动对测量的干扰,同时高精度地测量被测产品的降解敏感参数。高速采集测量数据,在线建立敏感参数随时间的退化模型,并根据退化模型计算样品的外推寿命。对于集成电路产品,我们开发了相应的测试验证系统,进行了有限样品的SRAM待机寿命和FPGA工作寿命,并探索了在测试方法中快速获取敏感参数退化趋势的可能性。为今后进一步的实践研究奠定了基础。
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