{"title":"Thermal Analysis of High Power LED Bulb. Comparison between Aluminum, Ceramic and Stainless Steel Package-On-Substrates","authors":"S. Tzanova, N. Kurtev","doi":"10.1109/ET.2019.8878320","DOIUrl":null,"url":null,"abstract":"In this paper, the thermal analysis of 3 different package-on-substrates for light emitting diode (LED) bulb is presented. The same aluminum heat sink was used for all simulations. The results are obtained using CFD simulation software.","PeriodicalId":306452,"journal":{"name":"2019 IEEE XXVIII International Scientific Conference Electronics (ET)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE XXVIII International Scientific Conference Electronics (ET)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ET.2019.8878320","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract
In this paper, the thermal analysis of 3 different package-on-substrates for light emitting diode (LED) bulb is presented. The same aluminum heat sink was used for all simulations. The results are obtained using CFD simulation software.
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