Practical process flows for monolithic 3D

Abstract

Three approaches to obtain monolithic 3D logic ICs are presented in this paper. RCAT - Process the high temperature on a generic structure prior to layer transfer (LT), and finish with cold processes; i.e., etch & depositions. Gate Replacement (Gate Last HKMG) - Process the high temperature on a repeating structure prior to LT, and finish with `gate replacement' cold processes. Laser Annealing - Use short laser pulses to locally heat and anneal the top layer while protecting the interconnection layers below from the topside heat. These approaches utilize well-known and manufacturing-friendly materials, process steps and device structures.