A. Vertepa, I. Starostina, N. Kuzina, Y.V. Perukhin, O. Stoyanov
{"title":"Modification of high-density polyethylene and ethylene-vinyl acetate copolymer by chain-layered silicate «sepiolite»","authors":"A. Vertepa, I. Starostina, N. Kuzina, Y.V. Perukhin, O. Stoyanov","doi":"10.31044/1994-6260-2022-0-11-24-30","DOIUrl":null,"url":null,"abstract":"Composites based on high-pressure polyethylene and ethylene-vinyl acetate copolymer, containing sepiolite clay powder with a chain-layered structure have been investigated, and their physical-mechanical properties have been analyzed. When using sepiolite, the organomodification and compatibilization are not required. It is shown, that composite materials with the addition of sepiolite are superior in a number of characteristics to those containing traditionally applied layered clay powders.","PeriodicalId":166286,"journal":{"name":"All the Materials. Encyclopedic Reference Book.","volume":"36 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"All the Materials. Encyclopedic Reference Book.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.31044/1994-6260-2022-0-11-24-30","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Composites based on high-pressure polyethylene and ethylene-vinyl acetate copolymer, containing sepiolite clay powder with a chain-layered structure have been investigated, and their physical-mechanical properties have been analyzed. When using sepiolite, the organomodification and compatibilization are not required. It is shown, that composite materials with the addition of sepiolite are superior in a number of characteristics to those containing traditionally applied layered clay powders.
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