{"title":"Lossy interconnect modeling from TDR/T measurements","authors":"J. Jong, V. K. Tripathi, L. A. Hayden, B. Janko","doi":"10.1109/EPEP.1994.594112","DOIUrl":null,"url":null,"abstract":"An experimental technique for the equivalent circuit modeling of lossy interconnects is presented. The technique is based on the extended peeling algorithm and is used to extract the circuit model from the TDR/T measured data. The accuracy of the circuit model is affirmed by comparing the measured results with the simulated results for a thin film microstrip line.","PeriodicalId":198939,"journal":{"name":"Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-11-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.1994.594112","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 9
Abstract
An experimental technique for the equivalent circuit modeling of lossy interconnects is presented. The technique is based on the extended peeling algorithm and is used to extract the circuit model from the TDR/T measured data. The accuracy of the circuit model is affirmed by comparing the measured results with the simulated results for a thin film microstrip line.
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