{"title":"Interconnect series impedance determination using a surface ribbon method","authors":"E. Tuncer, Beom-taek Lee, D. Neikirk","doi":"10.1109/EPEP.1994.594163","DOIUrl":null,"url":null,"abstract":"In this paper we apply the current filament method to surface \"ribbons\" instead of volume filaments, leading to a substantial reduction in problem size and increase in computational efficiency. The accuracy is excellent when compared to \"full Weeks\" calculations, with a factor of almost 100 reduction in CPU time.","PeriodicalId":198939,"journal":{"name":"Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging","volume":"45 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-11-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"26","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.1994.594163","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 26
Abstract
In this paper we apply the current filament method to surface "ribbons" instead of volume filaments, leading to a substantial reduction in problem size and increase in computational efficiency. The accuracy is excellent when compared to "full Weeks" calculations, with a factor of almost 100 reduction in CPU time.
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