Fast Bring-Up of an AI SoC through IEEE 1687 Integrating Embedded TAPs and IEEE 1500 Interfaces

Haiying Ma, Ligang Lu, Haitao Qian, Jing Han, Xin Wen, Fanjin Meng, Rahul Singhal, Martin Keim, Yu Huang, Wu Yang
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引用次数: 1

Abstract

Complex application specific SoC are being developed for hardware support artificial intelligence (AI) applications. Such a complex SoCs are integrating a large number of on-chip and off-chip memories, numerous cores and interfaces including in our case a hierarchy of embedded TAPs, as well as security measures and Design-For-Test (DFT) structures. In this case-study paper, we demonstrate using IEEE 1687-2014 (IJTAG) to integrate all these different components into a single, unifying methodology. From this, we derive the benefits of workflow efficiency and fast silicon bring-up. For example, we can report that silicon bring-up of the DFT of the entire SoC was completed in about 4 days, and other bring-up aspects of the Soc were also completed in very little time.
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基于IEEE 1687集成嵌入式tap和IEEE 1500接口的AI SoC快速启动
复杂的特定于应用的SoC正在为支持人工智能(AI)应用的硬件开发。这种复杂的soc集成了大量的片内和片外存储器,众多内核和接口,包括我们的嵌入式tap层次结构,以及安全措施和设计测试(DFT)结构。在这篇案例研究论文中,我们演示了使用IEEE 1687-2014 (IJTAG)将所有这些不同的组件集成到一个单一的统一方法中。由此,我们获得了工作流程效率和快速硅片生成的好处。例如,我们可以报告整个SoC的DFT的硅培养在大约4天内完成,并且SoC的其他培养方面也在很短的时间内完成。
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