W. Radlik, K. Plehnert, M. Zellner, A. Achen, R. Heistand, D. Castillo, R. Urscheler
{"title":"Mcm-D Technology for a Communication Application","authors":"W. Radlik, K. Plehnert, M. Zellner, A. Achen, R. Heistand, D. Castillo, R. Urscheler","doi":"10.1109/ICMCM.1994.753582","DOIUrl":null,"url":null,"abstract":"Taking advantage of the inherent capabilities of thin film technology, a cost competitive MCM-D has been built providing for a data communication assembly. For the dielectric layers, the novel photodefinable benzocyclobutene (BCB) has been employed. Thus, the material performance has been investigated and new processing steps have been developed to achieve a highly reliable formation of 10 /spl m/m vias at least.","PeriodicalId":363745,"journal":{"name":"Proceedings of the International Conference on Multichip Modules","volume":"24 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-04-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the International Conference on Multichip Modules","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMCM.1994.753582","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7
Abstract
Taking advantage of the inherent capabilities of thin film technology, a cost competitive MCM-D has been built providing for a data communication assembly. For the dielectric layers, the novel photodefinable benzocyclobutene (BCB) has been employed. Thus, the material performance has been investigated and new processing steps have been developed to achieve a highly reliable formation of 10 /spl m/m vias at least.
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