Packaged bulk micromachined resonant force sensor for high-temperature applications

M. Haueis, J. Dual, C. Cavalloni, M. Gnielka, R. Buser
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引用次数: 3

Abstract

We present a packaged micro resonator for static load measurement under high temperature, performing with high precision and a resolution better than 100 ppm. There is an industrial need for such measurement tasks, however, such sensing cells are not available so far. To minimize temperatures stress we developed an all-in-silicon, in difference to micro machined resonant force sensors, which have been published. We propose a force sensor where load coupling, the excitation and detection of the vibration of the micro resonator are integrated in one and the same single crystal silicon package. The complete single crystal design together with a fiber-optical on-chip detection method will allow measurements at high temperatures. A considerable degree of freedom for the resonator's shape design, as needed for the investigation of filer mechanisms, is given by a DRIE fabrication method.
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用于高温应用的封装体微机械谐振力传感器
我们提出了一种用于高温静态负载测量的封装微谐振器,具有高精度和优于100 ppm的分辨率。工业上需要这样的测量任务,然而,这样的传感单元到目前为止还没有。为了最大限度地减少温度应力,我们开发了一种全硅的,不同于微机械谐振力传感器,已经发表。我们提出了一种力传感器,将负载耦合、微谐振器的激励和振动检测集成在同一个单晶硅封装中。完整的单晶设计加上光纤片上检测方法将允许在高温下进行测量。谐振器的形状设计有相当大的自由度,这是研究滤波器机制所需要的,通过DRIE制造方法给出。
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