Cylindrical microcavity light emitters realized with double-oxide-confinement or single-defect photonic bandgap crystals

W. Zhou, J. Sabarinathan, B. Kochman, E. Berg, O. Qasaimeh, T. Brock, S. Pang, P. Bhattacharya
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Abstract

The confinement of light in one, two, and three dimensions on a wavelength-scale can lead to light emitting devices with enhanced efficiency, narrow spectral linewidth, improved directionality, and even enhanced spontaneous recombination rate (Yokoyama, 1992). In this paper, we describe the design, fabrication and characteristics of electroluminescent cylindrical microcavity surface emitters realized either by double oxide confinement or as a photonic bandgap (PBG) microcavity. In the latter, a single "point defect" in a 2D photonic crystal traps light and serves as a true microcavity. Comparison of different lateral confinement structures is made. Double oxide-confined devices are made with InP-based heterostructures (/spl lambda/=1.55 /spl mu/m) and consist of either InGaAs (bulk) or InGaAsP-InP pseudomorphic MQW recombination regions buried in InGaAsP or InP spacers of thickness /spl lambda//n. 120 nm thick In/sub 0.52/Al/sub 0.48/As layers are incorporated on both top and bottom of the cavity and appropriate p-type (top) and n-type (bottom) contact layers are included on both sides. The lateral microcavity size, defined by oxide confinement, ranges from 1 /spl mu/m to 30 /spl mu/m. PBG-based devices are made with GaAs-based heterostructures, which consist of an InGaAs MQW /spl lambda/-cavity (/spl lambda/=0.94 /spl mu/m). The 2D PBG formation is achieved by e-beam lithography and deep dry etching techniques. Single or multiple defects in the center define the /spl lambda/-sized microcavity. The PBG was designed to be centered around the cavity peak emission wavelength at 0.94 /spl mu/m.
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用双氧化物约束或单缺陷光子带隙晶体实现圆柱微腔光源
将光限制在波长尺度上的一维、二维和三维,可以使发光器件具有更高的效率、更窄的谱线宽度、更好的方向性,甚至提高自发复合率(Yokoyama, 1992)。本文介绍了采用双氧化物约束和光子带隙(PBG)微腔实现的电致发光圆柱形微腔表面发射器的设计、制造和特性。在后者中,二维光子晶体中的单个“点缺陷”捕获光并充当真正的微腔。并对不同的侧向约束结构进行了比较。双氧化物限制器件由InP基异质结构(/spl λ /=1.55 /spl mu/m)制成,由InGaAs(体)或InGaAsP-InP伪晶MQW复合区埋在厚度为/spl λ //n的InGaAsP或InP间隔层中组成。120 nm厚的In/sub 0.52/Al/sub 0.48/As层被合并在空腔的顶部和底部,并在两侧包括适当的p型(顶部)和n型(底部)接触层。由氧化物约束定义的横向微腔大小范围为1 /spl mu/m至30 /spl mu/m。基于pbg的器件采用基于gaas的异质结构制成,该异质结构由InGaAs MQW /spl lambda/-腔(/spl lambda/=0.94 /spl mu/m)组成。二维PBG的形成是通过电子束光刻和深干蚀刻技术实现的。中心的单个或多个缺陷定义了/spl λ /尺寸的微腔。设计的PBG以0.94 /spl mu/m的腔峰发射波长为中心。
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