D. Fratila, W. Palfinger, S. Bou, A. Almansa, W. Mann, C. Wogerer
{"title":"A Method for Measurement and Characterization of Microdispensing Process","authors":"D. Fratila, W. Palfinger, S. Bou, A. Almansa, W. Mann, C. Wogerer","doi":"10.1109/ISAM.2007.4288474","DOIUrl":null,"url":null,"abstract":"Adhesive dispensing - transferring of correct quantity of adhesive to the correct locations on the substrate and ensuring the adhesive remains in location until hardened - is a key process in adhesive bonding. Single part adhesive can be applied directly. Multi-component adhesives need to be mixed either before or during application. The methods and degree of advanced technology employed vary considerably between industry and applications. In lower volume and craft based industries the adhesive is often applied manually directly from a cartridge (e.g. using a sealant gun, or using a tool) to transfer and place the adhesive. In other industries (e.g. packaging or automotive) automated dispensing is more common. Electronics provides one of the most challenging tasks for adhesive dispensing-small components must be bonded precisely in position at high production rates. Dispensing technology in the electronics industry is being developed to meet this need [DUN 03].","PeriodicalId":166385,"journal":{"name":"2007 IEEE International Symposium on Assembly and Manufacturing","volume":"3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-07-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 IEEE International Symposium on Assembly and Manufacturing","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISAM.2007.4288474","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
Adhesive dispensing - transferring of correct quantity of adhesive to the correct locations on the substrate and ensuring the adhesive remains in location until hardened - is a key process in adhesive bonding. Single part adhesive can be applied directly. Multi-component adhesives need to be mixed either before or during application. The methods and degree of advanced technology employed vary considerably between industry and applications. In lower volume and craft based industries the adhesive is often applied manually directly from a cartridge (e.g. using a sealant gun, or using a tool) to transfer and place the adhesive. In other industries (e.g. packaging or automotive) automated dispensing is more common. Electronics provides one of the most challenging tasks for adhesive dispensing-small components must be bonded precisely in position at high production rates. Dispensing technology in the electronics industry is being developed to meet this need [DUN 03].
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