{"title":"The path to global connectivity — Wireless communication enters the next generation","authors":"J. Hausner","doi":"10.1109/SOCC.2017.8226040","DOIUrl":null,"url":null,"abstract":"As mobile broadband (MBB) technologies evolve, devices need to support increasing bandwidth with multiple frequencies and dramatically exploding data rates. New air interfaces in 5G will show once again the gain in data rates as we have seen from 2G, to 3G to HSPA, to LTE and LTE advanced. These technologies in a single device provide the best possible services with great user experience to all people no matter where they are. Developing the next generation takes advantage of higher density in analog and digital silicon circuitry to enable low cost high performance solutions. Next to those MBB systems, massive and reliable machine-type communications — also known as the Internet of Things — will get developed under the umbrella of 5G technologies. This talk will elaborate on challenges of related radio and semiconductor technologies, and highlight architectural breakthroughs to enable next generation solutions for global connectivity.","PeriodicalId":366264,"journal":{"name":"2017 30th IEEE International System-on-Chip Conference (SOCC)","volume":"33 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 30th IEEE International System-on-Chip Conference (SOCC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SOCC.2017.8226040","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
As mobile broadband (MBB) technologies evolve, devices need to support increasing bandwidth with multiple frequencies and dramatically exploding data rates. New air interfaces in 5G will show once again the gain in data rates as we have seen from 2G, to 3G to HSPA, to LTE and LTE advanced. These technologies in a single device provide the best possible services with great user experience to all people no matter where they are. Developing the next generation takes advantage of higher density in analog and digital silicon circuitry to enable low cost high performance solutions. Next to those MBB systems, massive and reliable machine-type communications — also known as the Internet of Things — will get developed under the umbrella of 5G technologies. This talk will elaborate on challenges of related radio and semiconductor technologies, and highlight architectural breakthroughs to enable next generation solutions for global connectivity.
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