Preencapsulation cleaning methods and control for microelectronics packaging

Abstract

We have prepared well-controlled substrates (such as SiO/sub 2/, SiN, SiON) for our cleaning experiments and have developed a series of cleaning processes that achieve the best cleaning results prior to encapsulation. These cleaning processes consist of both chlorofluorohydrocarbon (CFC) and non-CFC solutions including (d-limonene), isopropanol, new surfactants, high purity, deionized water (DI H/sub 2/O) and peroxide (H/sub 2/O/sub 2/), etc. Furthermore, we have demonstrated that contact angle measurements in a 100% RH environment are simple, fast and reliable in detecting the substrate surface cleanliness particularly with respect to hydrocarbon contamination on the first /spl sim/10 angstroms of surface layers. ESCA and contact angle measurement analyses are also used to quantify and correlate the cleaning processes. Results of these processes are given in this report.<>